SK Hynix announced on Thursday that it has delivered samples of its latest high-bandwidth memory chip, the 12-layer HBM4E, to key global customers.
The South Korean company, along with its domestic rival Samsung Electronics, is among the world's largest memory chip manufacturers. SK Hynix is a primary supplier of HBM chips to Nvidia, competing in this space with Samsung and the US-based Micron Technology. HBM chips are used in AI processors made by companies like Nvidia.
SK Hynix's statement and product details
SK Hynix stated, "Thanks to our advanced R&D and production expertise in the HBM field, we were able to deliver samples of the 12-layer stacked HBM4E on schedule." The company added, "We will work closely with our partners to ensure timely mass production."
The company highlighted that the 12-layer HBM4E offers improvements in both performance and power efficiency. The product achieves a maximum data processing speed of 16 Gbps per pin, with power efficiency improved by over 20% compared to the previous generation. According to the company, these enhancements boost data processing capabilities for AI training and inference.
SK Hynix further noted that its heat resistance has improved by 17% compared to the prior HBM4, enabling the memory chips to operate stably in high-performance computing environments.
The race for HBM4E sample delivery
HBM4E is the seventh generation of HBM. SK Hynix's HBM4E is expected to be used in Nvidia's next-generation AI accelerator, "Rubin Ultra," which is slated for release next year. On June 2nd, Jensen Huang visited the SK Hynix booth at the 2026 Computex Taipei exhibition in Taiwan, China, and wrote on an HBM4E wafer, "Please make more."
It is understood that SK Hynix will employ a 1c-nanometer process for its HBM4E core chips, while the base die will be manufactured by TSMC using a 3-nanometer process. SK Group Chairman Choi Tae-won said at Computex, "We are ready whenever the customer is ready." He added, "Currently, we have only one HBM4E customer."
In the HBM market, the timing of sample delivery is critical. Since next-generation HBM is custom-produced to specific client requirements, faster sample delivery allows customers to verify performance and complete optimization more quickly, gaining an advantage in the eventual mass production race.
Competitive landscape and market outlook
On May 29th, Samsung Electronics announced it had begun delivering the industry's first 12-layer 48GB HBM4E samples to key global customers. Following initial sample delivery and optimization, Samsung plans to begin mass production of HBM4E based on customer schedules.
An industry insider stated, "For HBM, not only performance but also scheduling factors like shipment timing and customer certification are crucial." They added, "In the second half of this year, the supply competition between the two companies (Samsung and SK Hynix) will intensify further."
Meanwhile, Micron's HBM4 production ramp-up is progressing smoothly, with plans to mass-produce HBM4E in 2027. Reports indicate its HBM4E will use a 10nm-class sixth-generation 1γ process, marking Micron's first introduction of EUV lithography equipment in a mass production process. The base die will be outsourced to TSMC for manufacturing.
Market research firm TrendForce previously noted that the three major suppliers are gradually shifting their industry focus from yield competition to pricing power and leadership in next-generation specifications. Although traditional DRAM profit margins have temporarily surpassed those of HBM, suppliers are maintaining a balanced product portfolio and are optimistic about long-term HBM contract prices rising. In a horizontal comparison, prices for various DDR and consumer-grade memory products other than HBM are already at relatively high levels after multiple previous rounds of price increases, whereas the pricing premium for HBM has not yet been fully realized.
Comments