Tianshui Huatian Technology Plans 3 Billion Yuan Investment for Second Phase Expansion of Nanjing IC Advanced Packaging and Testing Base

Stock News05-22

Tianshui Huatian Technology Co.,Ltd. (002185.SZ) has announced that its controlling subsidiary, Huatian Technology (Nanjing) Co., Ltd., intends to invest 3 billion yuan in the construction of the second-stage project for Phase II of the Huatian Nanjing Integrated Circuit Advanced Packaging and Testing Industrial Base. The project will involve renovation and expansion utilizing the existing land within the subsidiary's current premises, with plans to construct new factory buildings and supporting facilities covering a total floor area of approximately 83,300 square meters. Focusing on the full process flow for memory integrated circuit packaging and testing, the project will procure 2,772 sets of primary production process equipment and instruments. Upon completion and operation, the facility is expected to package and test approximately 430 million memory integrated circuits annually. This investment represents a significant move by the company to further expand its layout in the memory integrated circuit packaging and testing business, aligning with the rapid development of the industry. The products from this project will primarily be applied in areas such as artificial intelligence computing power, servers, consumer electronics, smart terminals, automotive electronics, and data centers. The implementation of this project will further consolidate the company's technological leadership, contribute to building a domestically independent and controllable semiconductor industry chain, and provide support for industrial upgrading.

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(002185.SZ) has announced that its controlling subsidiary, Huatian Technology (Nanjing) Co., Ltd., intends to invest 3 billion yuan in the construction of the second-stage project for Phase II of the Huatian Nanjing Integrated Circuit Advanced Packaging and Testing Industrial Base. The project will involve renovation and expansion utilizing the existing land within the subsidiary's current premises, with plans to construct new factory buildings and supporting facilities covering a total floor area of approximately 83,300 square meters. Focusing on the full process flow for memory integrated circuit packaging and testing, the project will procure 2,772 sets of primary production process equipment and instruments. Upon completion and operation, the facility is expected to package and test approximately 430 million memory integrated circuits annually. 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