Montage Technology (688008.SH) Sees Hong Kong IPO Prospectus Lapse

Stock News01-12

The application proof for the Hong Kong IPO submitted by Montage Technology Co., Ltd. (Montage Technology, 688008.SH) on July 11, 2025, has now lapsed after the standard six-month period, effective January 12, 2026. At the time of filing, China International Capital Corporation (CICC), Morgan Stanley, and UBS acted as its joint sponsors. According to the prospectus, the company is a globally leading fabless integrated circuit design firm, specializing in delivering innovative, reliable, and high-performance interconnect solutions for cloud computing and AI infrastructure. The company supplies interconnect chips, including memory interconnect chips and PCIe (Peripheral Component Interconnect Express)/CXL (Compute Express Link) interconnect chips, to leading industry clients, with applications spanning a wide range of end markets such as data centers, servers, and computing systems. Based on data from Frost & Sullivan, by revenue, the company ranked as the world's largest supplier of memory interconnect chips in 2024, capturing a market share of 36.8%.

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{"i18n":{"language":"en_US"},"isChannel":false,"data":{"share":"https://ttm.financial/m/news/1175315626?lang=en_US&edition=fundamental","thumbnail":"","is_english":true,"pubTime":"2026-01-12 10:36","share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","id":"1175315626","market":"fut","top_or_hot":-1,"title":"Montage Technology (688008.SH) Sees Hong Kong IPO Prospectus Lapse","media":"Stock News","content":"<p>The application proof for the Hong Kong IPO submitted by Montage Technology Co., Ltd. (Montage Technology, 688008.SH) on July 11, 2025, has now lapsed after the standard six-month period, effective January 12, 2026. At the time of filing, China International Capital Corporation (CICC), Morgan Stanley, and UBS acted as its joint sponsors.\nAccording to the prospectus, the company is a globally leading fabless integrated circuit design firm, specializing in delivering innovative, reliable, and high-performance interconnect solutions for cloud computing and AI infrastructure.\nThe company supplies interconnect chips, including memory interconnect chips and PCIe (Peripheral Component Interconnect Express)/CXL (Compute Express Link) interconnect chips, to leading industry clients, with applications spanning a wide range of end markets such as data centers, servers, and computing systems.\nBased on data from Frost & Sullivan, by revenue, the company ranked as the world's largest supplier of memory interconnect chips in 2024, capturing a market share of 36.8%.</p>","source":null,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Montage Technology (688008.SH) Sees Hong Kong IPO Prospectus Lapse</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nMontage Technology (688008.SH) Sees Hong Kong IPO Prospectus Lapse\n</h2>\n\n<h4 class=\"meta\">\n\n\n<a class=\"head\" href=\"https://laohu8.com/wemedia/1036600163\">\n\n\n<div class=\"h-thumb\" style=\"background-image:url(https://community-static.tradeup.com/news/b3bf6d02ad1a6e9e7377eebbb162346a);background-size:cover;\"></div>\n\n<div class=\"h-content\">\n<p class=\"h-name\">Stock News </p>\n<p class=\"h-time\">2026-01-12 10:36</p>\n</div>\n\n</a>\n\n\n</h4>\n\n</header>\n<article>\n<p>The application proof for the Hong Kong IPO submitted by Montage Technology Co., Ltd. (Montage Technology, 688008.SH) on July 11, 2025, has now lapsed after the standard six-month period, effective January 12, 2026. At the time of filing, China International Capital Corporation (CICC), Morgan Stanley, and UBS acted as its joint sponsors.\nAccording to the prospectus, the company is a globally leading fabless integrated circuit design firm, specializing in delivering innovative, reliable, and high-performance interconnect solutions for cloud computing and AI infrastructure.\nThe company supplies interconnect chips, including memory interconnect chips and PCIe (Peripheral Component Interconnect Express)/CXL (Compute Express Link) interconnect chips, to leading industry clients, with applications spanning a wide range of end markets such as data centers, servers, and computing systems.\nBased on data from Frost & Sullivan, by revenue, the company ranked as the world's largest supplier of memory interconnect chips in 2024, capturing a market share of 36.8%.</p>\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU2495084118.USD","symbol_name":"ALLIANZ CHINA A-SHARES \"ATH\" (USDHDG) ACC","start_time":0,"source_url":"","article_id":"1175315626","we_media_id":"1036600163","thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=1175315626","pubTimestamp":1768185381,"columns":[],"sourceInfo":null,"weMediaInfo":{"media_name":"Stock News","introduction":"Global Stock News First-Time Broadcast","home_visible":1,"id":"1036600163","head_image":"https://community-static.tradeup.com/news/b3bf6d02ad1a6e9e7377eebbb162346a"},"summary":"The application proof for the Hong Kong IPO submitted by Montage Technology Co., Ltd. (Montage Technology, 688008.SH) on July 11, 2025, has now lapsed after the standard six-month period, effective...","collect":0,"end_time":0,"defaultTopTitle":"","property":[],"viewcount":null,"language":"en","relate_stocks":{"91210":"澜起科技股份有限公司（临时代码）","688008":"澜起科技","LU2495084118.USD":"ALLIANZ CHINA A-SHARES \"ATH\" (USDHDG) ACC","LU1997245177.USD":"安联神洲A股基金","LU2476274720.SGD":"ALLIANZ CHINA FUTURE TECHNOLOGIES \"AT\" (SGDHDG) ACC","LU2476274308.USD":"ALLIANZ CHINA FUTURE TECHNOLOGIES \"AT\" (USD) ACC","LU1997244956.HKD":"ALLIANZ CHINA A-SHARES \"AT\" (HKD) ACC A","LU1997245094.SGD":"安联神州A股基金AT Acc SGD","LU2778985437.USD":"ALLIANZ CHINA FUTURE TECHNOLOGIES \"A\" (USD) INC","LU2039709279.SGD":"MANULIFE GF DRAGON GROWTH \"AA\" (SGDHDG) INC","BK0214":"IT设备","LU0456842615.SGD":"JPMorgan Funds - Emerging Markets Equity A (acc) SGD","LU2289578879.USD":"ALLIANZ CHINA A OPPORTUNITIES \"AT\" (USD) ACC"},"translate_title":"澜起科技(688008.SH)港股IPO招股书失效","themeId":"","isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"91210":1,"688008":1},"content_text":"The application proof for the Hong Kong IPO submitted by Montage Technology Co., Ltd. (Montage Technology, 688008.SH) on July 11, 2025, has now lapsed after the standard six-month period, effective January 12, 2026. At the time of filing, China International Capital Corporation (CICC), Morgan Stanley, and UBS acted as its joint sponsors.\nAccording to the prospectus, the company is a globally leading fabless integrated circuit design firm, specializing in delivering innovative, reliable, and high-performance interconnect solutions for cloud computing and AI infrastructure.\nThe company supplies interconnect chips, including memory interconnect chips and PCIe (Peripheral Component Interconnect Express)/CXL (Compute Express Link) interconnect chips, to leading industry clients, with applications spanning a wide range of end markets such as data centers, servers, and computing systems.\nBased on data from Frost & Sullivan, by revenue, the company ranked as the world's largest supplier of memory interconnect chips in 2024, capturing a market share of 36.8%.","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"-1","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":true,"tenantId":"TBGLOBAL","deviceId":"web-server-community-laohu8-v3","version":"4.36.0","shortVersion":"4.36.0","platform":"web","vendor":"web","appName":"ttm","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/1175315626","isCrawlerRequest":true}