Hunan Goke Microelectronics Announces Private Placement Plan to Raise Up to 5.06 Billion Yuan for AI Chip Development

Stock News07-17 21:32

The company has disclosed its plan for a private placement of shares in 2026.

The total funds to be raised from this offering are capped at 5.061 billion yuan, inclusive of all costs.

The net proceeds, after deducting issuance expenses, are earmarked for several key projects.

These include the research, development, and industrialization of a new generation of AI vision processing chips and solutions.

Funds will also support the research, development, and industrialization of media interaction AI chips.

Additionally, the capital will be used for the research, development, and industrialization of edge-side AI chips.

A portion of the raised funds is designated to supplement the company's working capital.

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