A new semiconductor packaging and testing facility focused on automotive electronics and robotics applications has officially commenced operations. The factory, named Jcet Group Automotive Electronics (Shanghai) Co., Ltd. (JSAC) and established by Jcet Group Co.,Ltd., held an opening ceremony recently in the Lingang New Area, marking the start of its formal production. This project represents another significant achievement in the integrated development of the integrated circuit and smart automotive industries within the Lingang New Area, while also injecting strong momentum into the upgrade of China's chip packaging and testing sector.
As a key strategic move by Jcet Group in the automotive electronics field, JSAC is designed to meet the development demands of vehicle electrification, intelligence, and connectivity. It systematically builds high-reliability, high-consistency manufacturing capabilities for automotive-grade chip products, focusing on core application areas such as intelligent driving, body and chassis control, and power and energy management. While strengthening its automotive-grade packaging and testing capabilities, the project has also developed the technical ability to seamlessly handle packaging and testing requirements for chips used in robotics control and perception. This creates a new synergistic development point for both automotive electronics and robotics chips, deeply integrating into Lingang's convergent industrial ecosystem.
The official operation of this factory signifies a new level of advancement for mainland China in the high-standard, high-performance automotive chip packaging and testing domain. The project's location in the Lingang New Area aligns precisely with the region's industrial development blueprint. Lingang has been cultivating industries like integrated circuits, intelligent new energy vehicles, and high-end equipment, having already established the "Eastern IC Port" as a full industrial chain cluster for integrated circuits. This provides comprehensive industrial support and synergistic advantages for automotive-grade and robotics chip packaging and testing. As the core area for Lingang's development into a national-level comprehensive integrated circuit industry base, the "Eastern IC Port" has gathered approximately 100 integrated circuit companies. By 2025, the Lingang New Area aims for the scaled industrial output value of its integrated circuit sector to exceed 30 billion yuan, with nearly 30 billion yuan completed in industrial investment, indicating continuous growth in industrial scale and development momentum.
As the world's third-largest and China's leading semiconductor packaging and testing provider, Jcet Group has long been building its presence in the automotive-grade sector. It has obtained IATF 16949 automotive quality management certification, and all eight of its major production bases possess automotive-grade packaging capabilities. Its client portfolio covers mainstream automakers such as Tesla and BYD. In the first three quarters of 2025, the company reported revenue of 28.669 billion yuan and a net profit attributable to shareholders of 954 million yuan. Revenue from its automotive electronics business saw a significant year-on-year increase of 34.2%, outpacing industry growth. The launch of the Lingang factory is expected to further unleash the company's manufacturing capacity for finished automotive-grade chip products.
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