Qinghe Chip Semiconductor Technology (Group) Co., Ltd. has completed its Pre-IPO funding round, according to a report.
The round was jointly invested by semiconductor industry players including Weihao Chuangxin and Shanghai Xiangju Investment, Xiamen Jingyao, United Nova Technology Co.,Ltd. (SSE: 688469), and Sichuan Development Sci-Tech Innovation Fund, alongside existing shareholders such as Advanced Micro-Fabrication Equipment Inc. China (SSE: 688012), Jucheng Capital, Cowin Capital, Inno Fund, Xindongneng, Yunhui Capital, ZERO2IPO (HKEX: 01945) Fund of Funds, CCB Investment, Tianchuang Capital, ZERO2IPO Industrial Investment, and Wofu Capital. Following the investment, the company's valuation has entered the unicorn ranks.
According to public information, Qinghe Chip was established in July 2020 and is headquartered in Beijing. It is a semiconductor heterogeneous integration platform technology and solution provider driven by a dual-engine model of "equipment manufacturing plus full-line services."
The company independently masters seven core technologies including surface activation, ultra-high vacuum, sub-micron precision alignment, temperature and pressure control, and thin-film bonding transfer, forming three major product lines: wafer bonding equipment, chip bonding equipment, and super atomic beam equipment. These are applied in fields such as HBM high-bandwidth memory, 2.5D/3D advanced packaging, sensing, and optical communications.
According to investor disclosures, after the company's second-phase equipment production line is completed and put into operation, annual capacity will rise to 200 units/sets, and revenue in 2026 is expected to achieve several-fold growth compared to 2025.
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