Novatek Enters HPC Sector with N4P Process SoC Tapeout

Deep News10-20

According to recent reports, Novatek, a Taiwanese integrated circuit (IC) design company, specializes in display driver chips (DDI) and digital multimedia SoCs for mobile devices and consumer electronics.

As reported by Taiwanese media, Novatek has completed the first batch of wafer tapeout verification for a high-performance computing (HPC) SoC in September this year. This milestone marks the company's strategic move into the data center, AI cloud services, and automotive computing markets. The report indicates that Novatek leveraged the Arm Total Design ecosystem for this HPC SoC, which is built upon the Arm Neoverse CSS N2 compute subsystem. The design utilizes a chiplet architecture, integrating DDR5 and HBM3e memory controllers, PCIe 6.0/CXL 2.0 interfaces, and 224G SerDes links. The process technology is based on TSMC's advanced N4P process and CoWoS advanced packaging.

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