Movement Alert｜Tianyu Advanced Falls 5.1% in Regular Trading, Semiconductor Sector Weakness Combined with SiC Pricing Pressure

Market Focus06-05

On June 5, Tianyu Advanced (02631.HK) fell 5.1% in regular trading to HKD 99.45, with turnover of HKD 217 million.

On the news front, the semiconductor sector weakened broadly, with major peers including ASMPT down 3.97%, GCL Technology down 2.63%, and Epiworld down 2.04%, demonstrating significant sector-wide selling pressure. Market concerns over continued price erosion for 8-inch silicon carbide substrates persisted, while the previously disclosed reduction by a shareholder holding over 5% — from 8.00% to 6.83% — remained undigested. Following a rebound earlier this week driven by a broker initiation with a Buy rating and Morgan Stanley accumulation, profit-taking resumed as short-term gains were locked in.

As the global leader with 51.3% market share in 8-inch SiC substrates, Tianyu Advanced has faced compounding headwinds since late May, including National IC Fund reductions across semiconductor names and the stock being removed from the STAR 50 Index effective June 12, adding passive fund outflow risk.

(The above content is based on publicly available market information, generated by a program or algorithm, and is intended solely as a stock movement alert. It does not constitute investment advice or a basis for trading decisions.)

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

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