To achieve a "strong start" for the development and construction of the new area, a ceremony for the commencement and commissioning of key projects for January 2026 was held this morning at the Yuanchuang Kexin Pilot Project site in the Lingang New Area. A total of 15 projects, encompassing industries, comprehensive bonded zones, commercial, cultural, sports, and tourism facilities, social livelihood projects, ecological greening, and water conservancy, were initiated, completed, or put into operation this January, with newly started projects representing a total investment of approximately 13.6 billion yuan.
The "Semiconductor Core Components and Systems Project," located in the Oriental Core Port area of the Lingang New Area, involves an investment of 5 billion yuan by Shanghai Yuanchuang Kexin Semiconductor Co., Ltd. Occupying about 108 mu of land with a total floor area of 150,000 square meters, the project will primarily establish standardized production lines for MFCs, gas cabinets, gas engineering, as well as vacuum gauges, power supplies, electrostatic chucks, SiC edge rings, pumps and valves, precision measurement equipment, scientific instruments, and specialized components for the pan-semiconductor industry. The project is scheduled to be constructed and begin production within 18 months, reaching full capacity three years after production starts. At full capacity, it is expected to achieve an annual output value of approximately 9.35 billion yuan and generate annual tax revenues of about 200 million yuan. The parent company of the project unit, Xian Dao Ke Ji Ji Tuan, has a presence across first to fourth-generation semiconductors and possesses complete semiconductor production processes and purification technologies. The group has deep expertise in the core components business for semiconductor equipment, with its products certified by industry leaders.
The Yibu Project is situated in the fourth phase of the Minlian Lingang Park, with a total investment of 3.6 billion yuan. It focuses on the core demands in the field of advanced semiconductor packaging and testing, aiming to establish a competitive R&D and industrial platform by introducing advanced equipment and software such as wafer-level underfill systems, wafer-level molding machines, and wafer-level reflow ovens. This initiative will drive R&D and industrialization in advanced packaging and testing, addressing industry challenges like insufficient translation of advanced packaging technologies and weak production capacity adaptability.
Other projects commencing simultaneously or in the near future include the Shuyuan Town Community Health Service Center, Wan Zhen Neng Yuan Gong Si's international R&D center in Lingang, the wide-body aircraft Phase III wing assembly project located in the Yangshan Special Comprehensive Bonded Zone, the supporting transportation and environmental improvement project for the Dishui Lake International Center on Huanhu Second Road in the main urban area of Lingang, and the supporting kindergarten for Plot 47-02 in Situan Town, Fengxian District.
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