TCL China Star CEO Zhao Jun recently discussed the company's potential move into semiconductor packaging during a media dialogue at the 2026 ChinaJoy event.
When asked about the possibility of transitioning from display panels to semiconductor packaging, Zhao Jun stated that the company is currently in the technical evaluation and early development stage. He noted that there is strong synergy between display panel manufacturing and advanced semiconductor packaging, particularly in core processes such as large glass substrate handling, thin film deposition, photolithography, etching, and automated material handling.
Zhao Jun revealed that the company has formed a specialized team focused on the technical challenges of glass substrate packaging. This team is engaging in technical discussions and collaborative problem-solving with customers. Currently, the company is conducting key process capability verification and concurrently advancing cooperation and joint development with target clients. He expects to showcase related samples in the second half of this year and begin preparations for building a pilot line development platform.
He also outlined three critical areas that need breakthroughs for glass substrate packaging to achieve industrialization. First, overcoming key technical challenges such as TGV copper filling, stress management in multi-layer structures, and deep processing of glass substrates. The current process routes are still being optimized to find the best technical solutions. Second, the maturity of upstream equipment and materials needs improvement, including the adaptation of glass raw materials and the performance and reliability upgrades of key equipment like through-hole drilling, electroplating, and CMP polishing. Third, comprehensive commercial validation is required, which involves verifying the functionality and reliability of glass substrates, achieving stable yield improvements, and effectively controlling costs during mass production. Zhao Jun emphasized that this is the ultimate threshold for the technology to move toward large-scale application.
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