An action plan to accelerate the high-level application of artificial intelligence across all domains, timeframes, and industries in Guangdong Province has been recently issued. The plan proposes that in the area of "AI + Integrated Circuits," the focus will be on the intelligent upgrade of the entire chip design and manufacturing process. This initiative aims to consolidate the province's advantages in integrated circuit design, expand the scale of manufacturing, and facilitate projects by companies such as Yuexin, Zengxin, and Runpeng Semiconductor to reach full production capacity.
Driven by application demands, the plan seeks to accelerate the empowerment of advanced materials, equipment, and component R&D and industrialization through AI. It emphasizes using AI technology to optimize the entire chip design and manufacturing workflow. In the design phase, technologies like AI-driven chip architecture optimization and operational simulation will be promoted to shorten design cycles and reduce trial-and-error costs. In the manufacturing phase, AI technologies such as automatic defect classification and dynamic yield prediction, along with intelligent inspection equipment, will be applied to enhance wafer yield and optimize process control.
Support will be provided for the R&D and industrialization of high-performance computing chips, edge AI chips, smart sensors, and optical chips. Additionally, efforts will be made to accelerate the application validation of AI chips in typical usage scenarios.
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