The Samsung Electronics Double Long ETF (07747) has surged over 7%, rising 6.85% to HKD 169.25 at the time of writing, with a trading volume of HKD 1.18 billion. According to market reports, Samsung Electronics Co., Ltd. has announced the shipment of the industry's first 12-layer HBM4E samples to key global clients, reinforcing its leadership in the next-generation HBM market. Following the earlier mass production and commercial shipment of the industry-leading HBM4, Samsung is now expanding its HBM roadmap with the introduction of HBM4E samples to meet the rapidly evolving demands of AI computing and hyperscale infrastructure. Notably, the HBM4E being shipped features a 12-layer stacked structure with a capacity of 48GB, with plans to release 32GB (8-layer) and 64GB (16-layer) versions to cater to diverse client needs. In terms of performance, HBM4E offers a memory bandwidth of up to 3.6TB/s, targeting high-intensity data processing scenarios for large language model (LLM) training and next-generation AI systems. Samsung stated that compared to the previous generation, HBM4E improves energy efficiency by 16% and thermal resistance by over 14%, contributing to enhanced reliability and reduced energy consumption in high-load data center environments.
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