BASICSEMI Shares Surge Over 8% Following Shenzhen Packaging Facility Breakthrough, Post-IPO Capacity Expansion Targets AI Growth Market

Stock News08-03

BASICSEMI (09971) shares surged more than 8%, trading up 6.94% at HK$48.10 as of press time, with a turnover of HK$12.7053 million. The company recently announced signing a general contracting agreement with China Construction Second Engineering Bureau Ltd. for a silicon carbide module packaging production line base project, marking a key step in capacity expansion for the "China's first silicon carbide chip stock" newly listed on the Hong Kong Stock Exchange's Main Board.

The board of BASICSEMI believes that entering into the project general contracting agreement will facilitate the company's future operational strategy, supporting efforts to meet growing downstream demand from new energy vehicles, intelligent computing centers, and photovoltaic energy storage. Notably, BASICSEMI's accelerated capacity build-up post-IPO coincides with the silicon carbide industry experiencing a profound cyclical reversal and price rally. Driven by supply-demand tightness, global leaders like Infineon and STMicroelectronics initiated price adjustments, with domestic substrate and device manufacturers following suit, pushing the entire industry into an upward price cycle. BASICSEMI recently issued a voluntary announcement to adjust prices for some products starting Q3 2026, with a maximum increase of up to 25%.

The timing of BASICSEMI's expansion plan, immediately after listing, reflects both its precise judgment of industry trends and a forward-looking approach to capacity deployment.

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