Epoxy Base Electronic Material to Build Advanced Packaging Film Materials (GBF) Project with Around RMB 270 Million Investment

Stock News10-20 18:18

Epoxy Base Electronic Material Corporation Limited (603002.SH) has announced that it signed a Project Investment Agreement with the Zhuhai Economic and Technological Development Zone Administrative Committee to invest in the construction of a new Advanced Packaging Film Materials (GBF) project, with a total investment of approximately RMB 270 million.

The project includes fixed asset investment of approximately RMB 220 million. The implementation entity is Zhuhai Hongchang Electronic Materials Co., Ltd., a wholly-owned subsidiary of the company. The construction period is 24 months.

If the investment project is successfully implemented, the company's advanced packaging film materials (GBF) will achieve large-scale supply, which can effectively increase the proportion of high value-added new materials business and have a positive impact on the company's future development.

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