Recent developments from the Shenzhen Pinghu Laboratory have been highly positive. The compound power semiconductor pilot platform, established in collaboration with Shenzhen Pengjin High-Tech Co., Ltd., had previously been approved as a Guangdong Provincial Semiconductor and Integrated Circuit (Compound Power Semiconductor) Pilot Platform. This year, it has further secured two significant accreditations: the Shenzhen Compound Power Semiconductor Small-to-Medium Pilot Base and the Ministry of Industry and Information Technology (MIIT) Key Cultivation Pilot Platform. This achievement represents a leapfrog upgrade from municipal support and provincial planning to national-level cultivation.
First Major Recognition: Inclusion in MIIT's Second Batch of Key Cultivation Pilot Platforms (Sole Shenzhen Entry)
Recently, the MIIT announced the preliminary list for its second batch of key cultivation pilot platforms. The compound power semiconductor pilot platform, jointly built by Shenzhen Pinghu Laboratory and Shenzhen Pengjin High-Tech Co., Ltd., was successfully selected, making it the only platform from Shenzhen to receive this honor in this round. Following its provincial accreditation, this marks another national-level authoritative recognition for the platform. It signifies that Shenzhen has joined the top tier nationally in the field of third-generation semiconductor technology commercialization, injecting core momentum into the high-quality development of the semiconductor industry in the Guangdong-Hong Kong-Macao Greater Bay Area.
The selection process for the MIIT's key cultivation pilot platforms focused on critical areas of manufacturing. It involved multiple rigorous stages, including voluntary application, local recommendation, and expert review, before finalizing the list. The compound power semiconductor pilot platform distinguished itself from over 2,400 registered applicants nationwide, earning a spot among the 111 selected for the second batch. Its success was based on its fully self-sufficient pilot capabilities, leading technological achievements, and a clear industrialization roadmap. Previously, the platform had been selected for the 2025 Guangdong Provincial Pilot Platform list, positioning it as a core provincial-level carrier for third-generation semiconductor pilot activities.
The progression from provincial recognition to national cultivation represents a significant upgrade for the platform. This advancement not only affirms the research strength of Shenzhen Pinghu Laboratory and the industrialization capabilities of Pengjin High-Tech but also highlights Shenzhen's strategic position and industrial advantages in compound power semiconductor areas such as silicon carbide (SiC) and gallium nitride (GaN).
Second Major Recognition: Designation as Shenzhen Compound Power Semiconductor Small-to-Medium Pilot Base
The Shenzhen Science and Technology Innovation Bureau has released the 2026 public notice for the recognition and funding assessment of concept verification centers and small-to-medium pilot bases. The Shenzhen Compound Power Semiconductor Small-to-Medium Pilot Base, jointly established by Shenzhen Pinghu Laboratory and Shenzhen Pengjin High-Tech Co., Ltd., was successfully included in the proposed funding list, formally receiving official municipal-level recognition.
This designation followed strict procedures in accordance with relevant regulations, involving multiple rounds of screening, professional evaluation, and public announcement. It signifies the municipal bureau's high recognition of the base's technical capabilities, platform development, and industrial value. Furthermore, it marks the addition of robust support to Shenzhen's pilot conversion system for the compound power semiconductor industry.
The base serves not only as a crucial extension of the provincial pilot platform but also as key infrastructure for Shenzhen's strategic layout in the third-generation semiconductor industry. As the world's first professional platform dedicated to research, development, and pilot production for 8-inch SiC and GaN, Shenzhen Pinghu Laboratory has achieved a monthly production capacity of 2,000 wafers. It has cumulatively validated over a hundred pieces of domestically produced equipment and dozens of types of core materials. The lab continues to provide the industry with comprehensive one-stop services, including professional pilot verification, process optimization, and technology transfer.
Looking ahead, Shenzhen Pinghu Laboratory will continue to enhance platform construction, aggregate innovative resources, tackle core technological challenges, openly share its pilot service capabilities, and deepen collaborative cooperation across the industry chain. It is committed to fully promoting the technological iteration, commercialization of achievements, and industrial clustering of compound power semiconductors. These efforts aim to inject strong momentum into Shenzhen's goal of becoming a global semiconductor industry innovation hub and support the high-quality development of strategic emerging industries in the Greater Bay Area.
Notably, from June 25 to 27, Wan Yuxi, Director of Shenzhen Pinghu Laboratory, is invited to attend the "2026 Conference on Power Semiconductor Devices and Integrated Circuits (CSPSD 2026)." Additionally, David ZHOU, the GaN Chief Scientist at Shenzhen Pinghu Laboratory, will deliver a keynote report titled "Achieving Record-Low RON,SP and RON×QG in Non-Regrowth Low-Voltage p-GaN Gate HEMTs Based on a 200 mm GaN-on-Si Platform." The industry eagerly awaits these contributions.
Key Conference Announcement
To better promote academic and industrial exchange in domestic power semiconductors and integrated circuits, and under the guidance of the Third Generation Semiconductor Industry Technology Innovation Strategic Alliance (CASA), the Shanghai Institute of Microsystem and Information Technology (Chinese Academy of Sciences), Geek Semiconductor Industry Network, and the Third Generation Semiconductor Industry will jointly host the "2026 Conference on Power Semiconductor Devices and Integrated Circuits (CSPSD 2026)" in Shanghai from June 25 to 27, 2026.
As a significant platform for academic and industrial exchange in China's power semiconductor field, CSPSD 2026 will feature formats including an opening ceremony, thematic forums, an exhibition, site visits, and a corporate run. The first batch of over 50 keynote report topics has been announced. The conference's speaker lineup encompasses three core groups from "industry, academia, research, and application": experts from national-level research institutes, university research teams, and leaders from leading enterprises. The report topics cover a comprehensive exchange system spanning from "basic research - technological breakthroughs - industrial application - future trends." The conference is dedicated to propelling technological innovation, academic exchange, and industrial collaborative development in power semiconductors and integrated circuits, empowering high-quality innovation and upgrading within China's semiconductor industry.
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