TIANYU SEMI (02658) Enters Strategic Cooperation Agreement with Qinghe Chip to Jointly Develop Bonding Material Processes and Technology Iteration

Stock News01-16

TIANYU SEMI (02658) announced that on January 16, 2026 (after trading hours), the Company and Qinghe Chip Semiconductor Technology (Group) Co., Ltd. entered into a strategic cooperation agreement. Pursuant to this agreement, the parties have agreed to establish a strategic partnership, leveraging the Company's strengths in silicon carbide materials and Qinghe Chip's capabilities in bonding equipment customization and optimization, to jointly undertake process development and technological iteration for bonding materials. These materials include bonded silicon carbide (SiC), silicon-on-insulator (SOI), piezoelectric-on-insulator (POI) substrates, and extra-large size (12-inch and above) SiC composite heat dissipation substrates.

The Board of Directors believes that the contracting parties will utilize their respective competitive advantages to establish a mutually beneficial partnership. By combining the Company's industry strength in SiC epitaxial wafers with Qinghe Chip's expertise in bonding integration technology and equipment, the collaboration aims to accelerate the development of advanced bonding material solutions and optimize production processes.

This cooperation is expected to enhance the Group's technical capabilities concerning large-size composite substrates, ensure equipment stability, and further consolidate the Group's market position.

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