HTSC (06886) has announced that in order to ensure the smooth execution of the interest payment for Huatai Securities Co., Ltd. 2025 Science and Technology Innovation Bond (Phase I) (Series 1) (Bond Abbreviation: 25 Huatai Securities Sci-Tech Bond 01A, Bond Code: 342580006.IB), and to facilitate investors in receiving their interest payments promptly, the relevant details are announced as follows: Total Issuance Amount: RMB 300 million; Coupon Rate for the Current Interest Period: 1.76%; Bond Term: 3-year floating rate bond; Interest Payment Date: March 22, 2026.
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