Bank of Beijing Successfully Issues First Credit Risk Mitigation Warrant to Support Private Manufacturing Tech Innovation Bonds

Deep News12-03

On December 3, financial news reported that according to the official WeChat account of Bank of Beijing, the bank's 2025 first-phase 25 Hengyi CP006 (Tech Innovation Bond) credit risk mitigation warrant has been successfully issued. The underlying bond is the sixth-phase 2025 technology innovation bond of Zhejiang Hengyi Group Co., Ltd. (referred to as "Hengyi Group"), with an issuance scale of 50 million yuan and a maturity of one year.

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