SK hynix has begun discussions with supply chain partners to prepare for the implementation and mass production of iHBM, a next-generation technology designed to reduce heat generation in high-bandwidth memory (HBM).
Against the backdrop of intensifying competition in the HBM market, this represents a strategic move by SK hynix to maintain its dominance in AI memory.
According to industry sources on the 21st, SK hynix has recently been in contact with domestic and overseas materials, components, and equipment partners to advance iHBM technology iteration and mass production preparation.
The two sides discussed plans for incorporating actual iHBM products and mass production schedules. A source from an SK hynix partner familiar with the project stated: "SK hynix is exploring supply chain collaboration to drive iHBM into formal process integration and achieve commercialization; it is verifying mass production feasibility and officially launching its commercialization layout."
iHBM is a technology that SK hynix publicly unveiled in May of this year. The core approach involves integrating an Integrated Cooling Element (ICE) onto the base die at the bottom layer of HBM.
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