TAIPEI, April 20 (Reuters) - Taiwanese chip firm TSMC, has raised $3.5 billon in bonds for its new plant in the U.S. state of Arizona, according to a term sheet.
Taiwan Semiconductor Manufacturing Co Ltd, a major Apple Inc supplier and the world's largest contract chip-maker, started construction last year at the Arizona site where it plans to spend $12 billion to build a computer chip factory.
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