AMD and Samsung Partner To Boos MI350 Chip Capabilities with Advanced Memory Tech

Benzinga04-27

Advanced Micro Devices, Inc (NASDAQ:AMD) signed a contract with Samsung Electronics (OTC:SSNLF) to supply HBM3E (5th generation high bandwidth memory) valued at approximately $3 billion (4 trillion ...

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NXT4
04-29
NXT4
Is this going to effect samsung users privacy, or beneficial

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Samsung started supplying samples to customers in February.Thedeal is worth about $3 billion , Viva 100reports.In exchange, Samsung Electronics will purchase AMD graphics processing units .Trend Force reports that the MI350’s bandwidth has increased by over 30% compared to its predecessor, the MI300. Although AMD’s chips havebeen recognizedas having greater capacity than similar-classNvidia Corp chips, they were seen as inferior in bandwidth. To counter this, AMD has chosen to use HBM3E, specifically designed to enhance bandwidth.This article AMD and Samsung Partner To Boos MI350 Chip Capabilities with Advanced Memory Tech originally appeared on Benzinga.com","collect":0,"end_time":0,"defaultTopTitle":"yahoo.com","property":[],"viewcount":null,"language":"en","relate_stocks":{"LU0127658192.USD":"EASTSPRING INVESTMENTS GLOBAL TECHNOLOGY \"A\" (USD) ACC","LU0256863811.USD":"ALLIANZ US EQUITY \"A\" INC","BK4529":"IDC概念","LU0289739343.SGD":"SUSTAINABLE GLOBAL THEMATIC PORTFOLIO \"A\" (SGD) ACC","LU1316542783.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD","BK4554":"元宇宙及AR概念","LU2458330169.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A\" (SGD) ACC","LU0170899867.USD":"EASTSPRING INVESTMENTS WORLD VALUE EQUITY  \"A\" (USD) ACC","LU2458330243.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A-H1\" (SGDHDG) ACC","IE0004445239.USD":"JANUS HENDERSON US FORTY \"A2\" (USD) ACC","IE00BJJMRX11.SGD":"Janus Henderson Balanced A Acc SGD","BK4534":"瑞士信贷持仓","LU0642271901.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD-H","BK4585":"ETF&股票定投概念","BK4567":"ESG概念","LU0079474960.USD":"联博美国增长基金A","LU0889565833.HKD":"FRANKLIN TECHNOLOGY \"A\" (HKD) ACC","GB00BDT5M118.USD":"天利环球扩展Alpha基金A Acc","BK4533":"AQR资本管理(全球第二大对冲基金)","LU0056508442.USD":"贝莱德世界科技基金A2","BK4575":"芯片概念","BK4566":"资本集团","LU1242518857.USD":"FULLERTON LUX FUNDS - ASIA ABSOLUTE ALPHA \"I\" (USD) ACC","LU1803068979.SGD":"FTIF - Franklin Technology A (acc) SGD-H1","LU0353189680.USD":"富国美国全盘成长基金Cl A Acc","IE00BJJMRY28.SGD":"Janus Henderson Balanced A Inc SGD","IE00B1XK9C88.USD":"PINEBRIDGE US LARGE CAP RESEARCH ENHANCED \"A\" (USD) ACC","LU1989764664.SGD":"CPR Invest - Global Disruptive Opportunities A2 Acc SGD-H","IE00BKDWB100.SGD":"PINEBRIDGE US LARGE CAP RESEARCH ENHANCED \"A5H\" (SGDHDG) ACC","LU0494093205.USD":"贝莱德ESG灵活多元资产A2 USD-H","LU0109392836.USD":"富兰克林科技股A","NVDA":"英伟达","BK4550":"红杉资本持仓","IE0004445015.USD":"JANUS HENDERSON BALANCED \"A2\" (USD) ACC","BK4141":"半导体产品","LU2264538146.SGD":"Fullerton Lux Funds - Global Absolute Alpha A Acc SGD","LU1242518931.SGD":"Fullerton Lux Funds - Asia Absolute Alpha A Acc SGD","BK4551":"寇图资本持仓","LU0466842654.USD":"HSBC ISLAMIC GLOBAL EQUITY INDEX \"A\" (USD) ACC","LU0097036916.USD":"贝莱德美国增长A2 USD","LU0511384066.AUD":"SUSTAINABLE GLOBAL THEMATIC PORTFOLIO \"A\" (AUDHDG) ACC","IE00B3M56506.USD":"NEUBERGER BERMAN EMERGING MARKETS EQUITY \"A\" (USD) ACC","AMD":"美国超微公司","IE00BD6J9T35.USD":"NEUBERGER BERMAN NEXT GENERATION MOBILITY \"A\" (USD) ACC","GFS":"GLOBALFOUNDRIES Inc.","LU0289961442.SGD":"SUSTAINABLE GLOBAL THEMATIC PORTFOLIO \"AX\" (SGD) ACC","BK4512":"苹果概念","LU0444971666.USD":"天利全球科技基金","IE0034235188.USD":"PINEBRIDGE GLOBAL FOCUS EQUITY \"A\" (USD) ACC","BK4548":"巴美列捷福持仓"},"translate_title":"AMD和三星合作，用先进的内存技术提升MI350芯片的性能","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"AMD":1,"GFS":1,"NVDA":0.9},"content_text":"Advanced Micro Devices, Inc (NASDAQ:AMD) signed a contract with Samsung Electronics (OTC:SSNLF) to supply HBM3E (5th generation high bandwidth memory) valued at approximately $3 billion (4 trillion won for its new data center chip, the MI350. \nSamsung Electronics has agreed to provide AMD with 12-layer HBM3E DRAM, slated for mass production in the year’s first half. Samsung started supplying samples to customers in February. The deal is worth about $3 billion (KRW 4.134 trillion), Viva 100 reports. \nAlso Read: Micron Dominates High-Bandwidth Memory Market, Anticipates Significant Revenue Growth: Analyst\nIn exchange, Samsung Electronics will purchase AMD graphics processing units (GPUs).\nThe supply will likely start in the second half of the year, aligning with AMD’s plans to begin mass production of chips then. AMD, initially planning to release the MI350 in the second half of this year and start mass production next year, has moved the release to the second quarter.\nTrend Force reports that the MI350’s bandwidth has increased by over 30% compared to its predecessor, the MI300. Although AMD’s chips have been recognized as having greater capacity than similar-class Nvidia Corp (NASDAQ:NVDA) chips, they were seen as inferior in bandwidth. To counter this, AMD has chosen to use HBM3E, specifically designed to enhance bandwidth.\nThis contract will likely be separate from Samsung Foundry operations. \nMeanwhile, SK Hynix has been Nvidia’s primary HBM supplier and leads the market. In April, SK Hynix announced plans to invest $3.9 billion in an advanced chip-packaging facility in West Lafayette, Indiana, focusing on mass-producing HBM.\nRecently, Nvidia CEO Jensen Huang endorsed Samsung Electronics’ HBM3E, signaling a potentially more collaborative relationship in the future.\nPrice Actions: AMD shares traded higher by 0.07% at $153.86 at the last check Friday. \nAlso Read: Nvidia, Broadcom Lead AI Charge: BofA Analyst Tips AMD, Micron as Emerging Contenders in Explosive Market Growth\nDisclaimer: This content was partially produced with the help of AI tools and was reviewed and published by Benzinga editors.\nPhoto by Pierre Lecourt via Flickr\n\"ACTIVE INVESTORS' SECRET WEAPON\" Supercharge Your Stock Market Game with the #1 \"news & everything else\" trading tool: Benzinga Pro - Click here to start Your 14-Day Trial Now!\nGet the latest stock analysis from Benzinga?\n\nADVANCED MICRO DEVICES (AMD): Free Stock Analysis Report\n\nThis article AMD and Samsung Partner To Boos MI350 Chip Capabilities with Advanced Memory Tech originally appeared on Benzinga.com\n© 2024 Benzinga.com. Benzinga does not provide investment advice. All rights reserved.","kind":"highlight","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0},"commentList":[{"id":300554961952864,"gmtCreate":1714397096506,"gmtModify":1714397100890,"author":{"id":"4160724652738952","authorId":"4160724652738952","name":"NXT4","avatar":"https://community-static.tradeup.com/news/8310d70514071510c800904e50175a58","vip":1,"hat":"https://static.tigerbbs.com/4c5ceab71416b120bab4604c0754b52a","crmLevel":1,"crmLevelSwitch":0,"idStr":"4160724652738952","authorIdStr":"4160724652738952"},"htmlText":"Is this going to effect samsung users privacy, or beneficial&nbsp;","listText":"Is this going to effect samsung users privacy, or beneficial&nbsp;","text":"Is this going to effect samsung users privacy, or beneficial","images":[],"top":1,"highlighted":1,"essential":1,"paper":1,"likeSize":1,"commentSize":0,"repostSize":0,"link":"https://ttm.financial/post/300554961952864","repostId":2430785536,"repostType":2,"isVote":1,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"tweetType":1,"langContent":"EN"}],"isCommentEnd":false,"newsSizeData":{"likeSize":1,"commentSize":1,"repostSize":1,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":true,"deviceId":"web-server-community-laohu8-v3","version":"4.29.3","shortVersion":"4.29.3","platform":"web","vendor":"web","appName":"ttm","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2430785536"}