AppAsia, CMSC to Explore Chip Opportunities; Shares Drop 3%

MT Newswires Live07-11

Appasia (KLSE:APPASIA) unit AppAsia Cloud inked a memorandum of understanding with CMSC to set up a joint special purpose venture entity, according to a Monday Malaysian bourse filing.

The joint special purpose venture entity will explore business opportunity of services of provision of integrated circuit design covering IC front-end design, back-end design, and turnkey services.

The collaboration is part of the company's strategic expansion into the semiconductor industry, particularly in IC design, it noted.

AppAsia's shares fell over 3% recently.

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Comments

We need your insight to fill this gap
Leave a comment