Shenzhen Edadoc Technology (SHE:301366) through unit Zhuhai Edadoc Circuit, signed a 357 million yuan contract with China Construction Third Engineering Bureau Group for the latter to construct the company's headquarters, according to a Monday filing on the Shenzhen Stock Exchange.
The headquarters, with an area of approximately 38,000.12 square meters, will be built in Beiwei District, Zhuhai High-tech Zone, China starting Oct. 1. Construction is expected to be completed on June 14, 2026, the Chinese printed circuit boards manufacturer said.
Shares of the company rose more than 1% at the close.
Price (RMB): ¥29.61, Change: ¥+0.32, Percent Change: +1.09%
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