Samsung struggles to secure a market share in the AI sector

CoinMarketCap11-01

Samsung Electronics is lagging behind SK Hynix when it comes to the manufacturing of high-bandwidth memory (HBM) chips for artificial intelligence servers. The company is still in the process of ...

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The company is still in the process of ...</p>\n\n<a href=\"https://coinmarketcap.com/community/articles/6723e8bb782e636f1cf8e7ef/\">Source Link</a>\n\n</div>\n","source":"coinmarketcap_highlight","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Samsung struggles to secure a market share in the AI sector</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nSamsung struggles to secure a market share in the AI sector\n</h2>\n\n<h4 class=\"meta\">\n\n\n2024-11-01 04:29 GMT+8&nbsp;&nbsp;&nbsp;<a href=https://coinmarketcap.com/community/articles/6723e8bb782e636f1cf8e7ef/><strong>CoinMarketCap</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>Samsung Electronics is lagging behind SK Hynix when it comes to the manufacturing of high-bandwidth memory (HBM) chips for artificial intelligence servers. The company is still in the process of ...</p>\n\n<a href=\"https://coinmarketcap.com/community/articles/6723e8bb782e636f1cf8e7ef/\">Source Link</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"BK4532","symbol_name":"文艺复兴科技持仓","start_time":0,"source_url":"https://coinmarketcap.com/community/articles/6723e8bb782e636f1cf8e7ef/","article_id":"2480062023","we_media_id":null,"thumbnails":["https://academy-public.coinmarketcap.com/srd-optimized-uploads/6de84eb61bfe42a6898bc5e51ac5816f.webp"],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2480062023","pubTimestamp":1730406587,"sourceInfo":{"source_id":"coinmarketcap_highlight","name":"CoinMarketCap"},"weMediaInfo":null,"summary":"Samsung Electronics is lagging behind SK Hynix when it comes to the manufacturing of high-bandwidth memory  chips for artificial intelligence servers. The company is still in the process of getting its latest products certified by Nvidia.According to a Bloomberg report, a senior executive from Samsung said that the South Korean company made progress during the qualification process with Nvidia, but the process isn’t complete yet. The electronics company is expecting to begin selling HBM3E, its most advanced memory chip, by the last quarter of 2024.Due to fierce competition with SK Hynix, Samsung investors remain cautiously optimistic about the company’s ability to secure market share for HBM chips. The delay in receiving approval from Nvidia gave SK Hynix and Micron Technology a head start, allowing them to sell chips faster, secure market share, and generate substantial revenue. Meanwhile, Samsung is contending with weak sales of mobile phone chips.After three weeks of releasing the l","collect":0,"end_time":0,"defaultTopTitle":"coinmarketcap.com","property":[],"viewcount":null,"language":"en","relate_stocks":{"BK4532":"文艺复兴科技持仓","BK4592":"伊斯兰概念","IE00B5949003.HKD":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A\" (HKD) ACC","IE0004445015.USD":"JANUS HENDERSON BALANCED \"A2\" (USD) ACC","IE00BKPKM429.USD":"NEUBERGER BERMAN GLOBAL SUSTAINABLE EQUITY \"A\" (USD) ACC","SOXS":"三倍做空半导体ETF-Direxion Daily","IE00BK4W5L77.USD":"HSBC GLOBAL FUNDS ICAV US EQUITY INDEX \"HC\" (USD) ACC","IE00BK4W5M84.HKD":"HSBC GLOBAL FUNDS ICAV US EQUITY INDEX \"HC\" (HKD) ACC","NVDA":"英伟达","BK4585":"ETF&股票定投概念","BK4534":"瑞士信贷持仓","IE00B19Z8X17.USD":"FTGF CLEARBRIDGE US LARGE CAP GROWTH  \"AG\" (USD) ACC","2NVD.UK":"2X NVIDIA ETP","BK4567":"ESG概念","BK4533":"AQR资本管理(全球第二大对冲基金)","IE00B3M56506.USD":"NEUBERGER BERMAN EMERGING MARKETS EQUITY \"A\" (USD) ACC","MU":"美光科技","BK4587":"ChatGPT概念","IE00BFSS8Q28.SGD":"Janus Henderson Balanced A Inc SGD-H","IE0034235188.USD":"PINEBRIDGE GLOBAL FOCUS EQUITY \"A\" (USD) ACC","L":"洛斯公司","HK0000320223.HKD":"TAIKANG KAITAI CHINA NEW OPPORTUNITIES FUND \"A\" (HKD) ACC","BK4579":"人工智能","IE00BJTD4N35.SGD":"Neuberger Berman US Long Short Equity A1  Acc SGD-H","BK4588":"碎股","BK4141":"半导体产品","BK4503":"景林资产持仓","IE0004086264.USD":"BNY MELLON GLOBAL OPPORTUNITIES \"A\" (USD) ACC","IE00BFSS7M15.SGD":"Janus Henderson Balanced A Acc SGD-H","BK4551":"寇图资本持仓","HK0000320264.USD":"TAIKANG KAITAI CHINA NEW OPPORTUNITIES FUND \"A\" (USD) ACC","HBM":"HudBay Minerals Inc","IE0034235295.USD":"PINEBRIDGE GLOBAL DYNAMIC ASSET ALLOCATION \"A\" (USD) ACC","IE00BN29S564.USD":"JANUS HENDERSON BALANCED \"A3\" (USD) INC","BK4581":"高盛持仓","HK0000306685.HKD":"TAIKANG KAITAI CHINA NEW OPPORTUNITIES FUND \"A\" (HKD) INC","IE00BJJMRX11.SGD":"Janus Henderson Balanced A Acc SGD","LU0053666078.USD":"摩根大通基金-美国股票A（离岸）美元","IE00BDCRKT87.USD":"PINEBRIDGE GLOBAL DYNAMIC ASSET ALLOCATION \"ADC\" (USD) INC","GB00BDT5M118.USD":"天利环球扩展Alpha基金A Acc","BK4549":"软银资本持仓","LU0056508442.USD":"贝莱德世界科技基金A2","SOXL":"三倍做多半导体ETF-Direxion Daily","IE00BZ199S13.USD":"BNY MELLON MOBILITY INNOVATION \"B\" (USD) ACC","BK4548":"巴美列捷福持仓","LU0048584097.USD":"FIDELITY FUNDS  GLOBAL THEMATIC OPPORTUNITIES \"A\" (USD) INC","IE00BJJMRY28.SGD":"Janus Henderson Balanced A Inc SGD","IE00BMPRXR70.SGD":"Neuberger Berman 5G Connectivity A Acc SGD-H","HK0000306701.USD":"TAIKANG KAITAI CHINA NEW OPPORTUNITIES FUND \"A\" (USD) INC","IE00BYXW3230.USD":"PINEBRIDGE GLOBAL DYNAMIC ASSET ALLOCATION \"AA\" (USD) ACC","IE00BKDWB100.SGD":"PINEBRIDGE US LARGE CAP RESEARCH ENHANCED \"A5H\" (SGDHDG) ACC","BK4168":"多种金属与采矿","3NVD.UK":"LS 3X NVIDIA"},"translate_title":"三星努力确保人工智能领域的市场份额","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"NVDA":1,"HBM":1,"MU":0.9,"SOXS":0.8,"SOXL":0.8,"L":0.6,"3NVD.UK":0.6,"2NVD.UK":0.6},"content_text":"Samsung Electronics is lagging behind SK Hynix when it comes to the manufacturing of high-bandwidth memory (HBM) chips for artificial intelligence servers. The company is still in the process of getting its latest products certified by Nvidia.\nAccording to a Bloomberg report, a senior executive from Samsung said that the South Korean company made progress during the qualification process with Nvidia, but the process isn’t complete yet. The electronics company is expecting to begin selling HBM3E, its most advanced memory chip, by the last quarter of 2024. \nDue to fierce competition with SK Hynix, Samsung investors remain cautiously optimistic about the company’s ability to secure market share for HBM chips. The delay in receiving approval from Nvidia gave SK Hynix and Micron Technology a head start, allowing them to sell chips faster, secure market share, and generate substantial revenue. Meanwhile, Samsung is contending with weak sales of mobile phone chips.\nSamsung’s semiconductor operating profit decline\nDue to delays in selling HBM chips, Samsung’s semiconductor division’s operating profit declined by nearly 50% from the expected 6.66 trillion KRW. The Korean company reported an operating profit of 3.86 trillion KRW (approximately $2.8 billion) from its semiconductor division. In contrast, SK Hynix achieved an operating profit of 7.03 trillion KRW (around $5.1 billion) in the third quarter. Additionally, SK Hynix plans to begin selling a 12-layer HBM3E chip, further advancing its lead over Samsung.\nSamsung stated that inventory adjustments had a negative impact on the sale of mobile phone chips. Moreover, the company is still dealing with a surplus of older components and hardware in China. The company still benefited from the sales of artificial intelligence and regular server products.\nTo circumvent the weak sales, the tech giant is cutting the production of legacy memory chips. This will allow the company to focus more on advancing manufacturing processes and produce more superior memory chips. Samsung estimates its capital expenditure for memory chips in 2024 will be around 47.9 trillion KRW. The company is expecting to begin manufacturing the next generation of HBM4 chips in the second half of 2025, said Jaejune Kim, executive VP at Samsung Electronics.\nSamsung issues an apology letter\nEarlier this month, the tech giant issued an apology letter for the disappointing projected operating profit of 9.10 trillion KRW. In the letter, Vice Chairman of Samsung Electronics, Jun Young-hyun said “Today, the management of Samsung Electronics would like to apologize to you first…We will definitely make the dire situation we are currently facing an opportunity for a leap forward. Our management will take the lead in overcoming the crisis…”\nAfter three weeks of releasing the letter, the actual earnings report revealed Samsung’s revenue, operating profit and net income. The company achieved 9.78 trillion KRW of net income which exceeded the expected 9.78 trillion KRW. Other divisions of the tech giant helped in balancing the decline in memory chip operations. \nHowever, Samsung recorded an operating profit of 9.18 trillion KRW, falling short of the expected 11.456 trillion KRW. The company’s revenue hit 79.1 trillion KRW, less than the 81.96 KRW expected by LSEG analysts. \nIn 2024 alone, Samsung lost 25% of its value and its listed shares in the South Korean stock exchange fell by 24.71%.","kind":null,"is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"-1","news_tag":"Business Data","news_rank":0,"symbols":[],"gpt_button":0},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":true,"deviceId":"web-server-community-laohu8-v3","version":"4.29.1","shortVersion":"4.29.1","platform":"web","vendor":"web","appName":"ttm","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2480062023"}