BRIEF-Seco, Nxp Sign Deal For AI SolutionsNov 11 (Reuters) - Seco SpA IOT.MI:
SAID ON MONDAY IT HAS SIGNED A PARTNERSHIP AGREEMENT WITH NXP SEMICONDUCTORS
DEAL AIMS TO COMBINE SECO'S CLEA SOFTWARE WITH NXP HARDWARE FOR INDUSTRIAL, IOT SECTORS
Further company coverage: IOT.MI
(Gdansk Newsroom)
((gdansk.newsroom@thomsonreuters.com; +48 58 769 66 00;))
Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.
Comments