外媒：英伟达新款Blackwell AI芯片面临过热问题，或致数据中心部署延期

环球网11-18

来源：环球网【环球网科技综合报道】11月18日，据路透社援引《信息》报道，英伟达最新发布的Blackwell AI芯片在服务器应用中遭遇了过热问题，引发了一系列关注与担忧。这一状况可能导致部分客户的数据中心部署计划被迫推迟。据悉，Blackwell芯片在连接到可容纳多达72个芯片的服务器机架时，会出现过热现象。多位知情人士透露，英伟达已多次要求供应商调整机架设计，以期解决这一技术难题。然而，尽管...

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AI芯片在服务器应用中遭遇了过热问题，引发了一系列关注与担忧。这一状况可能导致部分客户的数据中心部署计划被迫推迟。据悉，Blackwell芯片在连接到可容纳多达72个芯片的服务器机架时，会出现过热现象。多位知情人士透露，英伟达已多次要求供应商调整机架设计，以期解决这一技术难题。然而，尽管...</p>\n\n<a href=\"https://finance.sina.com.cn/jjxw/2024-11-18/doc-incwmzst0501787.shtml\">Source Link</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"IE00B7KXQ091.USD","symbol_name":"Janus Henderson Balanced A Inc 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