Marvell Introduces 1.6 Tbps LPO Chipset to Enable Optical Short-reach, Scale-up Compute Fabric Interconnects

PR Newswire12-11

Addresses the Speed and Reach Limitations of Passive, Direct-attached Copper (DAC) Cables SANTA CLARA, Calif., Dec. 10, 2024 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data...

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(NASDAQ: MRVL), a leader in data...</p>\n\n<a href=\"https://finance.yahoo.com/news/marvell-introduces-1-6-tbps-210000747.html\">Source Link</a>\n\n</div>\n","source":"yahoofinance","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Marvell Introduces 1.6 Tbps LPO Chipset to Enable Optical Short-reach, Scale-up Compute Fabric Interconnects</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nMarvell Introduces 1.6 Tbps LPO Chipset to Enable Optical Short-reach, Scale-up Compute Fabric Interconnects\n</h2>\n\n<h4 class=\"meta\">\n\n\n2024-12-11 05:00 GMT+8&nbsp;&nbsp;&nbsp;<a href=https://finance.yahoo.com/news/marvell-introduces-1-6-tbps-210000747.html><strong>PR Newswire</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>Addresses the Speed and Reach Limitations of Passive, Direct-attached Copper (DAC) Cables  \nSANTA CLARA, Calif., Dec. 10, 2024 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data...</p>\n\n<a href=\"https://finance.yahoo.com/news/marvell-introduces-1-6-tbps-210000747.html\">Source Link</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU2272731865.HKD","symbol_name":"ALLIANZ GLOBAL INTELLIGENT CITIES INCOME \"AM\" (HKD) INC","start_time":0,"source_url":"https://finance.yahoo.com/news/marvell-introduces-1-6-tbps-210000747.html","article_id":"2490027948","we_media_id":null,"thumbnails":["https://s.yimg.com/uu/api/res/1.2/GehyWTP0qG8yBju0psDbbA--~B/aD0xMTU7dz00MDA7YXBwaWQ9eXRhY2h5b24-/https://media.zenfs.com/en/prnewswire.com/55195f9cfdbb0e4f1631b7c35e2839d5"],"rights":{"source":"yahoofinance","url":"https://finance.yahoo.com/news/marvell-introduces-1-6-tbps-210000747.html","rn_cache_url":null,"customStyle":"img, svg { display: none !important; }","selectors":"article","filters":"","directOrigin":true},"url":"https://stock-news.laohu8.com/highlight/detail?id=2490027948","pubTimestamp":1733864400,"columns":[],"sourceInfo":{"source_id":"yahoofinance","name":"雅虎金融"},"weMediaInfo":null,"summary":"Addresses the Speed and Reach Limitations of Passive, Direct-attached Copper  Cables. As artificial intelligence  technologies advance, the demand for higher-bandwidth interconnects in data center networks is accelerating rapidly. This is particularly evident in compute fabric networks, which connect XPUs within and across racks. The next generation of XPU compute fabric networks will transition to data rates of 200 Gbps per lane, where passive DACs fall short of meeting speed and distance requirements.\"LPO has been a technology in search of the right solution. By optimizing chipsets for short, inside-the-rack connections, Marvell brings clarity and focus to LPO,delivering it in a more compelling and scalable manner,\" said Alan Weckel, co-founder of 650 Group. \"Marvell's innovative approach to achieving performance gains helps drive better AI cluster TCO and highlights the industry's direction in optimizing networking links.","collect":0,"end_time":0,"defaultTopTitle":"yahoo.com","property":[],"viewcount":null,"language":"en","relate_stocks":{"LU2272731865.HKD":"ALLIANZ GLOBAL INTELLIGENT CITIES INCOME \"AM\" (HKD) INC","LU1548497426.USD":"安联环球人工智能AT Acc","LU1861220033.SGD":"Blackrock Next Generation Technology A2 SGD-H","LU0127658192.USD":"EASTSPRING INVESTMENTS GLOBAL TECHNOLOGY \"A\" (USD) ACC","LU0154236417.USD":"BGF US FLEXIBLE EQUITY \"A2\" ACC","LU1316542783.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD","BK4515":"5G概念","LU1720051108.HKD":"ALLIANZ GLOBAL ARTIFICIAL INTELLIGENCE \"AT\" (HKD) ACC","LU2458330169.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A\" (SGD) ACC","BK4585":"ETF&股票定投概念","LU0187121727.USD":"FIDELITY SUSTAINABLE US EQUITY \"A\" (USD) INC","LU2357305700.SGD":"Allianz Global Artificial Intelligence ET H2-SGD","LU2458330243.SGD":"FRANKLIN SHARIAH TECHNOLOGY \"A-H1\" (SGDHDG) ACC","MRVL":"迈威尔科技","LU0642271901.SGD":"Janus Henderson Horizon Global Technology Leaders A2 SGD-H","LU2244417387.USD":"FIDELITY SUSTAINABLE US EQUITY \"A\" (USD) ACC","LU2473716301.USD":"ALLIANZ GLOBAL INTELLIGENT CITIES INCOME \"AMF\" (USD) INC","LU0056508442.USD":"贝莱德世界科技基金A2","LU1992135399.USD":"Allianz Global Intelligent Cities AT Acc USD","LU1989764664.SGD":"CPR Invest - Global Disruptive Opportunities A2 Acc SGD-H","LU2272731782.SGD":"Allianz Global Intelligent Cities AM Dis H2-SGD","BK4020":"通信设备","OCC":"Optical Cable Corporation","IE00BMPRXR70.SGD":"Neuberger Berman 5G Connectivity A Acc SGD-H","LU1989764748.USD":"东方汇理环球颠覆性机遇A2 Acc","BK4588":"碎股","IE00BMPRXN33.USD":"NEUBERGER BERMAN 5G CONNECTIVITY \"A\" (USD) ACC","LU1169590202.USD":"ALLSPRING (LUX)  U.S. SELECT EQUITY \"I\" (USD) ACC","LU2322448791.USD":"ALLIANZ GLOBAL INTELLIGENT CITIES INCOME \"AMG\" (USD) INC","BK4141":"半导体产品","LU2272731600.USD":"Allianz Global Intelligent Cities AM Dis USD","DAC":"达那俄斯","LU1861215975.USD":"贝莱德新一代科技基金 A2","LU1169589451.USD":"ALLSPRING (LUX)  U.S. SELECT EQUITY \"A\" (USD) ACC","LU2322448957.HKD":"ALLIANZ GLOBAL INTELLIGENT CITIES INCOME \"AMG\" (HKD) INC","LU1992135472.HKD":"ALLIANZ GLOBAL INTELLIGENT CITIES \"AT\" (HKD) ACC","PHH":"Park Ha Biological Technology Co. Ltd.","BK4581":"高盛持仓","WRD":"文远知行","BK4021":"海运","LU1720051017.SGD":"Allianz Global Artificial Intelligence AT Acc H2-SGD","LU1852331112.SGD":"Blackrock World Technology Fund A2 SGD-H","LU0061475181.USD":"THREADNEEDLE (LUX) AMERICAN \"AU\" (USD) ACC"},"translate_title":"Marvell推出1.6 Tbps LPO芯片组，实现光学短程、可扩展计算结构互连","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"WRD":1,"PHH":1,"OCC":1,"DAC":1,"MRVL":0.9},"content_text":"Addresses the Speed and Reach Limitations of Passive, Direct-attached Copper (DAC) Cables  \nSANTA CLARA, Calif., Dec. 10, 2024 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced the general availability of a 200G per lane optimized transimpedance amplifier (TIA) and laser driver chipset, enabling 800 Gbps and 1.6 Tbps linear-drive pluggable optics (LPO). Designed to address next-generation short-reach, scale-up compute fabric connectivity requirements, LPO modules enabled by the chipset overcome the reach limitations of passive, DAC cable interconnects. The LPO chipset expands the industry-leading interconnect portfolio from Marvell, which includes PAM4 optical DSPs, coherent DSPs, data center interconnects, Alaska® A active electrical cable (AEC) DSPs and Alaska P PCIe retimers, delivering an optimized optical solution for short-reach compute fabric connections, delivering an optimized optical solution for short-reach compute fabric connections.\nAs artificial intelligence (AI) technologies advance, the demand for higher-bandwidth interconnects in data center networks is accelerating rapidly. This is particularly evident in compute fabric networks, which connect XPUs within and across racks. The next generation of XPU compute fabric networks will transition to data rates of 200 Gbps per lane, where passive DACs fall short of meeting speed and distance requirements.\nTo address this, cloud data centers will transition to a new type of interconnect that meets their specific requirements. Marvell introduced Alaska A for customers looking to extend copper capabilities using AECs, while others can leverage specialized LPO modules featuring the Marvell TIA and driver chipset. Designed for short and predictable host channels, these LPO modules enable longer reach, higher bandwidth and improved performance compared to copper interconnects.\n\"Marvell 1.6 Tbps LPO TIA and laser driver chipset is designed to address the growing demand for short-reach, high-bandwidth interconnect solutions, where passive copper cables are hitting a wall,\" said Xi Wang, vice president of product marketing for Optical Connectivity at Marvell. \"As AI-driven data centers continue to scale, optimizing interconnect solutions across each layer of the network is becoming increasingly critical. The new LPO chipset complements and expands our industry-leading 1.6 Tbps connectivity portfolio, to address the growing spectrum of interconnects that cloud operators are seeking to optimize.\"\n\"LPO has been a technology in search of the right solution. By optimizing chipsets for short, inside-the-rack connections, Marvell brings clarity and focus to LPO, delivering it in a more compelling and scalable manner,\" said Alan Weckel, co-founder of 650 Group. \"Marvell's innovative approach to achieving performance gains helps drive better AI cluster TCO and highlights the industry's direction in optimizing networking links.\"\nThe 1.6 Tbps LPO chipset, one of the latest additions to the Marvell interconnect portfolio, is optimized for specific use cases to help data centers maximize infrastructure utilization and performance while reducing overall cost and power per bit. This extensive portfolio spanning optical and copper interconnects includes Ara, the industry's first 3nm PAM4 interconnect platform; Aquila, the industry's first O-band-optimized coherent-lite DSP platform; Nova family of PAM4 DSPs featuring 200 Gbps electrical and optical interfaces; and Alaska A PAM4 DSP for active electrical cables.\nLPO Chipset Key Features \n\nTIA provides best-in-class linearity, power and BER for AI applications.\nLaser driver to improve module performance margin while reducing overall transceiver module design complexity, power consumption, and TCO.\nTIA and laser driver chipset provide adjustable equalization to compensate for channel loss.\n\nAbout MarvellTo deliver the data infrastructure technology that connects the world, we're building solutions on the most powerful foundation: our partnerships with our customers. Trusted by the world's leading technology companies for over 25 years, we move, store, process and secure the world's data with semiconductor solutions designed for our customers' current needs and future ambitions. Through a process of deep collaboration and transparency, we're ultimately changing the way tomorrow's enterprise, cloud, automotive, and carrier architectures transform—for the better.\nMarvell and the M logo are trademarks of Marvell or its affiliates. Please visit www.marvell.com for a complete list of Marvell trademarks. Other names and brands may be claimed as the property of others.\nThis press release contains forward-looking statements within the meaning of the federal securities laws that involve risks and uncertainties. Forward-looking statements include, without limitation, any statement that may predict, forecast, indicate or imply future events, results or achievements. Actual events, results or achievements may differ materially from those contemplated in this press release. Forward-looking statements are only predictions and are subject to risks, uncertainties and assumptions that are difficult to predict, including those described in the \"Risk Factors\" section of our Annual Reports on Form 10-K, Quarterly Reports on Form 10-Q and other documents filed by us from time to time with the SEC. Forward-looking statements speak only as of the date they are made. Readers are cautioned not to put undue reliance on forward-looking statements, and no person assumes any obligation to update or revise any such forward-looking statements, whether as a result of new information, future events or otherwise.\nFor further information, contact:Kim Marklepr@marvell.com\n\n\n\n\n\n View original content to download multimedia:https://www.prnewswire.com/news-releases/marvell-introduces-1-6-tbps-lpo-chipset-to-enable-optical-short-reach-scale-up-compute-fabric-interconnects-302328139.html\nSOURCE Marvell","kind":"highlight","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"productRelease","news_rank":0,"symbols":[],"gpt_button":0},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":true,"deviceId":"web-server-community-laohu8-v3","version":"4.29.4","shortVersion":"4.29.4","platform":"web","vendor":"web","appName":"ttm","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2490027948"}