Shengyi Electronics (SHA:688183) is planning to invest 1.4 billion yuan in building the intelligent computing power center high-layer high-density interconnected circuit board project.
The project will be built in the existing factory building of the company's Dongguan manufacturing base, according to a Dec. 7 filing with the Shanghai bourse.
Annual production is targeted at 250,000 square meters of high-layer high-density interconnection printed circuit boards.
The two-phase construction will take six years to complete.
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