Texas Instruments announces award agreement for CHIPS and Science Act funding

PR Newswire12-21

Up to $1.6 billion in direct funding supports TI's semiconductor manufacturing expansions in Texas and Utah NEWS HIGHLIGHTS: The U.S. Department of Commerce has awarded TI up to $1.6 billion in CHIPS...

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}","selectors":"article","filters":"","directOrigin":true},"url":"https://stock-news.laohu8.com/highlight/detail?id=2493420171","pubTimestamp":1734717900,"columns":[],"sourceInfo":{"source_id":"yahoofinance","name":"雅虎金融"},"weMediaInfo":null,"summary":"Up to $1.6 billion in direct funding supports TI's semiconductor manufacturing expansions in Texas and Utah. The U.S. Department of Commerce has awarded TI up to $1.6 billion in CHIPS Act funding to support three new 300mm semiconductor wafer fabs under construction in Texas and Utah.LEHI, Utah and SHERMAN, Texas, Dec. 20, 2024 /PRNewswire/ -- Texas Instruments   and the U.S. Department of Commerce today announced an award agreement of up to $1.6 billion in direct funding through the U.S. CHIPS and Science Act, following the preliminary memorandum of terms announced in August 2024. The funding will help support three of TI's new 300mm wafer fabs currently under construction in Texas and Utah.Support from the CHIPS Act, including the 25% investment tax credit, will help TI provide a geopolitically dependable supply of essential analog and embedded processing semiconductors.Combined, TI's three new fabs in Texas and Utah will create 2,000 company jobs, along with thousands of indirect jo","collect":0,"end_time":0,"defaultTopTitle":"yahoo.com","property":[],"viewcount":null,"language":"en","relate_stocks":{"BK4141":"半导体产品","LU2413666699.HKD":"BNP PARIBAS GLOBAL ENVIRONMENT \"CRH\" (HKDHDG) INC","TXN":"德州仪器","SG9999003800.SGD":"Nikko AM Global Dividend Equity Acc SGD-H","IE0008368304.USD":"STEWART INVESTORS WORLDWIDE LEADERS SUSTAINABILITY FUND \"I\" (USD) ACC","LU0553294199.USD":"BGF GLOBAL EQUITY INCOME \"A5G\" (USD) INC","LU2413666426.HKD":"BNP PARIBAS GLOBAL ENVIRONMENT \"C\" (HKD) ACC","BK4561":"索罗斯持仓","IE00BFXG0V08.USD":"BNY MELLON GLOBAL LEADERS \"B\" (USD) ACC","LU1983260115.SGD":"Janus Henderson Horizon Global Sustainable Equity A2 SGD-H","LU0545039389.USD":"BGF GLOBAL EQUITY INCOME \"A2\" ACC","LU0312595415.SGD":"Schroder ISF Global Climate Change Equity A Acc SGD","BK4581":"高盛持仓","BK4512":"苹果概念","IE00BZ199S13.USD":"BNY MELLON MOBILITY INNOVATION \"B\" (USD) ACC","LU1823568750.SGD":"Fidelity Global Technology A-ACC SGD","SG9999011175.SGD":"Nikko AM Global Dividend Equity Dis SGD-H","LU0345774631.USD":"NINETY ONE GSF AMERICAN FRANCHISE \"A\" (USD) INC","IE00BYQQ9H92.USD":"BNY MELLON GLOBAL LEADERS \"A\" (USD) ACC","LU0661504455.SGD":"Blackrock Global Equity Income A5 SGD-H","LU1721428933.USD":"法巴全球经典环境基金RH MD Dis","BK4554":"元宇宙及AR概念","LU0314104364.USD":"MANULIFE GF AMERICAN GROWTH \"AA\" (USD) INC","LU2129689514.USD":"FRANKLIN GLOBAL INCOME \"A\" (USD) INC","LU1066051498.USD":"HSBC GIF GLOBAL EQUITY VOLATILITY FOCUSED \"AM2\" (USD) INC","LU1066053197.SGD":"HSBC GIF GLOBAL EQUITY VOLATILITY FOCUSED \"AM3\" (SGDHDG) INC","LU1003077747.HKD":"BGF GLOBAL EQUITY INCOME \"A6\" (HKDHDG) INC","BK4567":"ESG概念","LU1674673691.USD":"HSBC GIF GLOBAL LOWER CARBON EQUITY \"AD\" (USD) INC","LU0949170772.SGD":"Blackrock Global Equity Income A6 SGD-H","BK4585":"ETF&股票定投概念","LU0345774391.USD":"NINETY ONE GSF AMERICAN FRANCHISE \"A\" (USD) ACC","LU1046421795.USD":"富达环球科技A-ACC","LU0868494617.USD":"UBS (LUX) EQUITY SICAV - US TOTAL YIELD SUSTAINABLE \"P\" (USD) ACC","BK4534":"瑞士信贷持仓","BK4588":"碎股","BK4533":"AQR资本管理(全球第二大对冲基金)","LU1674673428.USD":"HSBC GIF GLOBAL LOWER CARBON EQUITY \"AC\" (USD) ACC","LU1778281490.HKD":"HSBC GIF GLOBAL LOWER CARBON EQUITY \"AD\" (HKD) INC","LU1244550577.SGD":"FTIF - Franklin Global Multi-Asset Income A (Mdis) SGD-H1","LU1244550221.USD":"FRANKLIN GLOBAL MULTI-ASSET  INCOME \"A\" (USDHEDGED) INC (M)","LU0347712357.USD":"BNP PARIBAS GLOBAL ENVIRONMENT \"C\" (USD) ACC","LU2129689431.USD":"FRANKLIN GLOBAL INCOME \"A\" (USD) ACC","LU2129689605.HKD":"FRANKLIN GLOBAL INCOME \"A\" (HKD) INC","LU2133065610.SGD":"JPMorgan Investment Funds - Global Dividend A (mth) SGD","LU1235294995.USD":"FIDELITY GLOBAL TECHNOLOGY \"A\" (USDHDG) ACC","LU0738911758.USD":"Blackrock Global Equity Income A6 USD","IE0009356076.USD":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A2\" (USD) ACC","LU1244550494.USD":"FRANKLIN GLOBAL MULTI-ASSET INCOME \"A\" (USDHEDGED) ACC","LU0557290698.USD":"施罗德环球可持续增长基金"},"translate_title":"德州仪器宣布CHIPS和科学法案资助的奖励协议","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"TXN":1},"content_text":"Up to $1.6 billion in direct funding supports TI's semiconductor manufacturing expansions in Texas and Utah\nNEWS HIGHLIGHTS:\n\nThe U.S. Department of Commerce has awarded TI up to $1.6 billion in CHIPS Act funding to support three new 300mm semiconductor wafer fabs under construction in Texas and Utah.\nTI also expects to receive an estimated $6 billion to $8 billion from the U.S. Department of the Treasury's Investment Tax Credit for qualified U.S. manufacturing investments.\nThe company will also receive up to $10 million to support workforce development.\n\nLEHI, Utah and SHERMAN, Texas, Dec. 20, 2024 /PRNewswire/ -- Texas Instruments (TI) (Nasdaq: TXN) and the U.S. Department of Commerce today announced an award agreement of up to $1.6 billion in direct funding through the U.S. CHIPS and Science Act, following the preliminary memorandum of terms announced in August 2024. The funding will help support three of TI's new 300mm wafer fabs currently under construction in Texas and Utah. Support from the CHIPS Act, including the 25% investment tax credit, will help TI provide a geopolitically dependable supply of essential analog and embedded processing semiconductors.\n\"As the largest analog and embedded processing semiconductor manufacturer in the U.S., TI is uniquely positioned to provide dependable, low-cost 300mm semiconductor manufacturing capacity at scale,\" said Haviv Ilan, president and CEO of Texas Instruments. \"The increasing number of electronic devices in our lives depend on our foundational chips, and we appreciate the support from the U.S. government to make the semiconductor ecosystem stronger and more resilient.\"\nThe CHIPS Act direct funding will support TI's investments through 2029 for three large-scale 300mm wafer fabs in Sherman, Texas (SM1 and SM2), and Lehi, Utah (LFAB2). Together, these fabs will manufacture tens of millions of analog and embedded processing chips every day that are critical to a variety of end markets, including automotive, industrial, personal electronics, communications equipment and enterprise systems.\nSpecifically, the CHIPS Act direct funding will be distributed upon completion of project milestones, supporting: \n\nCleanroom construction and tool installations at SM1 in Sherman, Texas;\nShell construction of SM2, a second fab in Sherman, Texas; and\nCleanroom construction and tool installations at LFAB2, a second fab in Lehi, Utah.\n\nThese connected, multi-fab sites in Texas and Utah will benefit from shared infrastructure, talent and technology sharing, and a strong network of existing suppliers and community partners. \nCombined, TI's three new fabs in Texas and Utah will create 2,000 company jobs, along with thousands of indirect jobs for construction, suppliers and supporting industries. TI is also investing in building its future workforce. As part of the CHIPS Act award agreement, TI will also receive up to $10 million for workplace development efforts in Texas and Utah.\nConsistent with TI's longstanding commitment to responsible, sustainable manufacturing and environmental stewardship, the company's 300mm wafer fabs will be entirely powered by renewable electricity. Additionally, TI is committed to reducing overall water consumption across its operations, endeavoring to achieve a 70% water reuse capability in Sherman, Texas, and Lehi, Utah. All of TI's new 300mm fabs are also designed to meet LEED Gold standards for structural efficiency and sustainability.\nLearn more:\n\nTI CHIPS Act press kit (includes images, video b-roll, fact sheet)\nTI Sherman, Texas, press kit\nTI Lehi, Utah, press kit\n\nNotice regarding forward-looking statements\nThis release includes forward-looking statements intended to qualify for the safe harbor from liability established by the Private Securities Litigation Reform Act of 1995. These forward-looking statements generally can be identified by phrases such as TI or its management \"believes,\" \"expects,\" \"anticipates,\" \"foresees,\" \"forecasts,\" \"estimates\" or other words or phrases of similar import. Similarly, statements herein that describe TI's business strategy, outlook, objectives, plans, intentions or goals also are forward-looking statements. All such forward-looking statements are subject to certain risks and uncertainties that could cause actual results to differ materially from those in forward-looking statements.\nSee Item 1A of TI's most recent Form 10-K for a detailed discussion of risk factors that could cause results to differ materially from the forward-looking statements. The forward-looking statements included in this release are made only as of the date of this release, and we undertake no obligation to update the forward-looking statements to reflect subsequent events or circumstances. If we do update any forward-looking statement, you should not infer that we will make additional updates with respect to that statement or any other forward-looking statement.\nAbout Texas Instruments\nTexas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips for markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com.\n\n\n\n\n  \n\n View original content to download multimedia:https://www.prnewswire.com/news-releases/texas-instruments-announces-award-agreement-for-chips-and-science-act-funding-302337541.html\nSOURCE Texas Instruments","kind":"highlight","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"policyRegulatory","news_rank":0,"symbols":[],"gpt_button":1},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":true,"deviceId":"web-server-community-laohu8-v3","version":"4.29.4","shortVersion":"4.29.4","platform":"web","vendor":"web","appName":"ttm","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2493420171"}