Taiwan Semiconductor stock jumped 3% in overnight trading. Taiwan Semiconductor Manufacturing Co’s $(TSM)$ plan to produce 2nm chips in Taiwan is progressing steadily as the contract chipmaker prepares to begin commercializing 4nm chips at its Arizona fab.
The chipmaker has completed limited risk production of ~5,000 wafers leveraging its 2nm process at the Baoshan fab in Hsinchu Science Park, TechNode reports.
Taiwan Semiconductor has planned to roll out its 2nm production at the Baoshan and Kaohsiung fabs.
During an earnings call, Taiwan Semiconductor Chair C.C. Wei said the company does not expect a shift toward chipset designs driven by high-performance computing (HPC) to affect its 2nm production.
Wei said that growing interest in 2nm has increased demand, surpassing 3nm.
Taiwan Semiconductor launched the N2P process technology to support smartphone and high-performance computing (HPC) applications. Mass production will begin in the second half of 2026, he added.
Taiwan Semiconductor stock surged over 101% in the last 12 months.
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