South Korean car parts firm Hyundai Mobis (KRX:012330) and Qualcomm Technologies collaborated to develop a next-generation high-performance computer (HPC) platform for vehicles, Qualcomm said earlier this week.
The partnership combines Qualcomm's Snapdragon Ride Flex system-on-chip and automated driving stack with Hyundai Mobis' advanced software and sensors to enhance infotainment and driver assistance systems. This integrated solution aims to deliver superior performance, safety, and efficiency for automakers globally, the release said.
Shares of Hyundai Mobis rose nearly 1% at market close on Thursday.
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