Shanghai Fudan Microelectronics Signs Technology Services Agreement with Fudan University

Reuters07-28
<a href="https://laohu8.com/S/SFDMF">Shanghai Fudan Microelectronics</a> Signs Technology Services Agreement with Fudan University

Shanghai Fudan Microelectronics Group Co. Ltd. has announced the signing of a Technology Services Agreement with Fudan University. The agreement, signed on July 28, 2025, after trading hours, involves Fudan University conducting research and development on ultra-large scale FPGA layout and routing technology, along with providing technical support. The service fees for this collaboration are approximately RMB184,466.00. This connected transaction is subject to reporting, announcement, and annual review requirements but is exempt from disclosure in circular and independent shareholders' approval, as per Chapter 14A of the Listing Rules.

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