Shanghai Fudan Microelectronics Group Co. Ltd. has announced the signing of a Technology Services Agreement with Fudan University. The agreement, signed on July 28, 2025, after trading hours, involves Fudan University conducting research and development on ultra-large scale FPGA layout and routing technology, along with providing technical support. The service fees for this collaboration are approximately RMB184,466.00. This connected transaction is subject to reporting, announcement, and annual review requirements but is exempt from disclosure in circular and independent shareholders' approval, as per Chapter 14A of the Listing Rules.
Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Shanghai Fudan Microelectronics Group Co. Ltd. published the original content used to generate this news brief on July 28, 2025, and is solely responsible for the information contained therein.
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