有投资者在互动平台向世运电路提问：“请问董秘；公司针对2025年下半年以及2026年的业绩增幅有没有信心，目前大环境这么好的前提下，公司进展都这么慢，下半年开始竞争加剧，公司如何规划。”
针对上述提问，世运电路回应称：“尊敬的投资者，您好！公司在产能布局与技术升级层面持续布局：一方面，泰国工厂一期规划产能50万平方米/年，预计2025 年末投产，产能的扩充将为业绩增长提供有力支撑。另一方面，公司拟投资15亿元建设‘芯创智载’新一代PCB制造基地，生产芯片内嵌式PCB（埋芯产品）和提升高阶HDI产品产能。高阶HDI结合芯片封装，有望进一步提升公司在PCB制造及半导体领域的综合竞争力。谢谢！”
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