Market Chatter: Toshiba Unit Ends China Chip Collaboration with SICC Over Security Concerns

MT Newswires Live10-30

Toshiba Corp. (TYO:6502) subsidiary Toshiba Electronic Devices & Storage has ended a technical cooperation agreement with Chinese silicon carbide wafer supplier SICC (SHA:688234, HKG:2631), citing economic security concerns, Nikkei reported Thursday.

The deal, signed in August to improve wafer quality and ensure stable supply, was terminated last month following discussion between the parties, according to the report.

A person familiar with the matter said the partnership was halted amid caution that cooperation beyond procurement could risk technology and talent leakage. Toshiba will continue sourcing wafers from SICC, the report said.

(Market Chatter news is derived from conversations with market professionals globally. This information is believed to be from reliable sources but may include rumor and speculation. Accuracy is not guaranteed.)

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(TYO:6502) subsidiary Toshiba Electronic Devices &amp; Storage has ended a technical cooperation agreement with Chinese silicon carbide wafer supplier SICC (SHA:688234, HKG:2631), citing economic security concerns, Nikkei reported Thursday.</p><p>The deal, signed in August to improve wafer quality and ensure stable supply, was terminated last month following discussion between the parties, according to the report.</p><p>A person familiar with the matter said the partnership was halted amid caution that cooperation beyond procurement could risk technology and talent leakage. Toshiba will continue sourcing wafers from SICC, the report said.</p><p>(Market Chatter news is derived from conversations with market professionals globally. This information is believed to be from reliable sources but may include rumor and speculation. 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(TYO:6502) subsidiary Toshiba Electronic Devices &amp; Storage has ended a technical cooperation agreement with Chinese silicon carbide wafer supplier SICC (SHA:688234, HKG:2631), citing economic security concerns, Nikkei reported Thursday.</p><p>The deal, signed in August to improve wafer quality and ensure stable supply, was terminated last month following discussion between the parties, according to the report.</p><p>A person familiar with the matter said the partnership was halted amid caution that cooperation beyond procurement could risk technology and talent leakage. Toshiba will continue sourcing wafers from SICC, the report said.</p><p>(Market Chatter news is derived from conversations with market professionals globally. This information is believed to be from reliable sources but may include rumor and speculation. 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