Solstice Advanced Materials Breaks Ground on $200 Million Spokane Facility Expansion

Reuters2025-12-03
Solstice Advanced Materials Breaks Ground on $200 Million Spokane Facility Expansion

Solstice Advanced Materials Inc. has announced a $200 million expansion of its electronic materials facility in Spokane Valley, Washington. The project will double the facility's production capacity for sputtering targets by the end of 2029, supporting increased demand in the semiconductor industry. The expansion aims to reduce lead times by 25%, enable circular production by reclaiming and reusing metals from used sputtering targets, and lower carbon emissions by over 300 metric tons per year. Solstice says the investment will strengthen its U.S. manufacturing footprint and support the development of next-generation semiconductor technologies.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Solstice Advanced Materials Inc. published the original content used to generate this news brief via PR Newswire (Ref. ID: NY36921) on December 02, 2025, and is solely responsible for the information contained therein.
Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Comments

We need your insight to fill this gap
Leave a comment