0838 GMT - Advanced Micro-Fabrication Equipment's plan to acquire Sizone Electronic Technology aligns with its goal to expand into the chemical mechanical planarization business, Daiwa analysts say in a research note. CMP is a critical process using chemical slurries and mechanical polishing to create perfectly flat, smooth wafer surfaces. AMEC aims to expand its product coverage from etching, deposition to wet process tools like CMP, the analysts say. Sizone, established in 2018, is a fairly young company with a team from Silicon Valley, the analysts note. Daiwa estimates that China's 2025 CMP demand is around 9.5 billion yuan, with a localization rate close to 40%. Hwatsing is the CMP leader in China, with a large market share in memory and legacy nodes. (sherry.qin@wsj.com)
(END) Dow Jones Newswires
December 19, 2025 03:38 ET (08:38 GMT)
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