QuickLogic Wins $88 Million U.S. Government Contract for Radiation Hardened FPGA Development

Reuters12-18 20:04

QuickLogic Wins $88 Million U.S. Government Contract for Radiation Hardened FPGA Development

QuickLogic Corporation announced an expansion of its strategic radiation hardened FPGA contract with the U.S. government. The total contract ceiling has been increased to approximately $88 million over multiple years. The scope now includes development using GlobalFoundries' 12LP fabrication process. QuickLogic has completed the design and tape-out of a test chip for this project, which is sponsored by the Department of Defense’s Trusted and Assured Microelectronics Program, with the Naval Surface Warfare Center Crane serving as the technical lead.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. QuickLogic Corporation published the original content used to generate this news brief via PR Newswire (Ref. ID: SF50586) on December 18, 2025, and is solely responsible for the information contained therein.

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