BRIEF-Shengyi Technology Signs Investment Intention Agreement For Copper-Clad Laminate Project

Reuters01-04 17:01
BRIEF-Shengyi Technology Signs Investment Intention Agreement For Copper-Clad Laminate Project

Jan 4 (Reuters) - Shengyi Technology Co Ltd 600183.SS:

  • SAYS CO SIGNED INVESTMENT INTENTION AGREEMENT FOR COPPER-CLAD LAMINATE PROJECT WORTH AROUND 4.5 BILLION YUAN ($643.49 million)

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Further company coverage: 600183.SS

($1 = 6.9931 Chinese yuan renminbi)

(Reporting by Beijing Newsroom)

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