Cadence Launches Chiplet Ecosystem with Arm, Samsung, and Industry Partners

Reuters01-06

Cadence Launches Chiplet Ecosystem with <a href="https://laohu8.com/S/ARM">Arm</a>, Samsung, and Industry Partners

Cadence Design Systems Inc. has launched a Chiplet Spec-to-Packaged Parts ecosystem aimed at reducing engineering complexity and accelerating time to market for chiplet development in physical AI, data center, and high-performance computing applications. As part of this initiative, Cadence is collaborating with Samsung Foundry to create a silicon prototype demonstration of its Physical AI chiplet platform using the Samsung Foundry SF5A process. The ecosystem also includes key IP partners such as Arm, Arteris, eMemory, M31 Technology, Silicon Creations, and Trilinear Technologies, with silicon analytics support from proteanTecs. This collaboration is designed to help customers adopt advanced chiplet technologies more efficiently and reliably.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Cadence Design Systems Inc. published the original content used to generate this news brief via Business Wire (Ref. ID: 20260106077060) on January 06, 2026, and is solely responsible for the information contained therein.

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{"i18n":{"language":"en_US"},"isChannel":false,"data":{"share":"https://ttm.financial/m/news/2601781815?lang=en_US&edition=fundamental","thumbnail":"","is_english":true,"pubTime":"2026-01-06 22:01","share_image_url":"https://static.laohu8.com/e9f99090a1c2ed51c021029395664489","id":"2601781815","market":"us","top_or_hot":-1,"title":"Cadence Launches Chiplet Ecosystem with Arm, Samsung, and Industry Partners","media":"Reuters","content":"<html xmlns=\"http://www.w3.org/1999/xhtml\" xmlns:newsg2=\"http://iptc.org/std/nar/2006-10-01/\" xmlns:xhtml=\"http://www.w3.org/1999/xhtml\"><head><title>\n      Cadence Launches Chiplet Ecosystem with <a href=\"https://laohu8.com/S/ARM\">Arm</a>, Samsung, and Industry Partners\n    </title></head><body><div xmlns:xsd=\"http://www.w3.org/2001/XMLSchema\" xmlns:xsi=\"http://www.w3.org/2001/XMLSchema-instance\">\n<p>\n        Cadence Design Systems Inc. has launched a Chiplet Spec-to-Packaged Parts ecosystem aimed at reducing engineering complexity and accelerating time to market for chiplet development in physical AI, data center, and high-performance computing applications. As part of this initiative, Cadence is collaborating with Samsung Foundry to create a silicon prototype demonstration of its Physical AI chiplet platform using the Samsung Foundry SF5A process. The ecosystem also includes key IP partners such as Arm, Arteris, eMemory, M31 Technology, Silicon Creations, and Trilinear Technologies, with silicon analytics support from proteanTecs. This collaboration is designed to help customers adopt advanced chiplet technologies more efficiently and reliably.\n      </p>\n</div><div xmlns:xsd=\"http://www.w3.org/2001/XMLSchema\" xmlns:xsi=\"http://www.w3.org/2001/XMLSchema-instance\">\n<p>\n<i>Disclaimer: <span>This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Cadence Design Systems Inc. published the original content used to generate this news brief via Business Wire (Ref. ID: 20260106077060) on January 06, 2026, and is solely responsible for the information contained therein.</span></i>\n</p>\n</div></body></html>","source":null,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Cadence Launches Chiplet Ecosystem with Arm, Samsung, and Industry Partners</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nCadence Launches Chiplet Ecosystem with Arm, Samsung, and Industry Partners\n</h2>\n\n<h4 class=\"meta\">\n\n\n<a class=\"head\" href=\"https://laohu8.com/wemedia/1032215980\">\n\n\n<div class=\"h-thumb\" style=\"background-image:url(https://community-static.tradeup.com/news/4567337cbdf294b657b1fa87c5488b48);background-size:cover;\"></div>\n\n<div class=\"h-content\">\n<p class=\"h-name\">Reuters </p>\n<p class=\"h-time\">2026-01-06 22:01</p>\n</div>\n\n</a>\n\n\n</h4>\n\n</header>\n<article>\n<html xmlns=\"http://www.w3.org/1999/xhtml\" xmlns:newsg2=\"http://iptc.org/std/nar/2006-10-01/\" xmlns:xhtml=\"http://www.w3.org/1999/xhtml\"><head><title>\n      Cadence Launches Chiplet Ecosystem with <a href=\"https://laohu8.com/S/ARM\">Arm</a>, Samsung, and Industry Partners\n    </title></head><body><div xmlns:xsd=\"http://www.w3.org/2001/XMLSchema\" xmlns:xsi=\"http://www.w3.org/2001/XMLSchema-instance\">\n<p>\n        Cadence Design Systems Inc. has launched a Chiplet Spec-to-Packaged Parts ecosystem aimed at reducing engineering complexity and accelerating time to market for chiplet development in physical AI, data center, and high-performance computing applications. As part of this initiative, Cadence is collaborating with Samsung Foundry to create a silicon prototype demonstration of its Physical AI chiplet platform using the Samsung Foundry SF5A process. The ecosystem also includes key IP partners such as Arm, Arteris, eMemory, M31 Technology, Silicon Creations, and Trilinear Technologies, with silicon analytics support from proteanTecs. This collaboration is designed to help customers adopt advanced chiplet technologies more efficiently and reliably.\n      </p>\n</div><div xmlns:xsd=\"http://www.w3.org/2001/XMLSchema\" xmlns:xsi=\"http://www.w3.org/2001/XMLSchema-instance\">\n<p>\n<i>Disclaimer: <span>This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Cadence Design Systems Inc. published the original content used to generate this news brief via Business Wire (Ref. ID: 20260106077060) on January 06, 2026, and is solely responsible for the information contained therein.</span></i>\n</p>\n</div></body></html>\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU0170899867.USD","symbol_name":"EASTSPRING INVESTMENTS WORLD VALUE EQUITY  \"A\" (USD) ACC","start_time":0,"source_url":"https://api.refinitiv.com/data/news/v1/stories/urn:newsml:reuters.com:20260106:nNDL7q0w5M:1","article_id":"2601781815","we_media_id":"1032215980","thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2601781815","pubTimestamp":1767708085,"columns":[],"sourceInfo":null,"weMediaInfo":{"media_name":"Reuters","introduction":"Reuters.com brings you the latest news from around the world, covering breaking news in markets, business, politics, entertainment and technology","home_visible":1,"id":"1032215980","head_image":"https://community-static.tradeup.com/news/4567337cbdf294b657b1fa87c5488b48"},"summary":"Cadence Design Systems Inc. has launched a Chiplet Spec-to-Packaged Parts ecosystem aimed at reducing engineering complexity and accelerating time to market for chiplet development in physical AI, data center, and high-performance computing applications. As part of this initiative, Cadence is collaborating with Samsung Foundry to create a silicon prototype demonstration of its Physical AI chiplet platform using the Samsung Foundry SF5A process. The ecosystem also includes key IP partners such as Arm, Arteris, eMemory, M31 Technology, Silicon Creations, and Trilinear Technologies, with silicon analytics support from proteanTecs. This collaboration is designed to help customers adopt advanced chiplet technologies more efficiently and reliably.Disclaimer: This news brief was created by Public Technologies  using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be i","collect":0,"end_time":0,"defaultTopTitle":"","property":[],"viewcount":null,"language":"en","relate_stocks":{"LU0170899867.USD":"EASTSPRING INVESTMENTS WORLD VALUE EQUITY  \"A\" (USD) ACC","BK4585":"ETF&股票定投概念","BK4588":"碎股","LU1951198990.SGD":"Natixis Thematics AI & Robotics Fund H-R/A SGD-H","IE00BN0W2W23.USD":"GUINNESS SUSTAINABLE GLOBAL EQUITY \"C\" (USD) ACC","LU2764263203.CNY":"BGF GLOBAL UNCONSTRAINED EQUITY \"A2\" (CNYHDG) ACC","LU0312595415.SGD":"Schroder ISF Global Climate Change Equity A Acc SGD","LU2275660780.HKD":"SCHRODER ISF GLOBAL CLIMATE CHANGE EQUITY \"A\" (HKD) ACC","AIP":"Arteris, Inc.","LU2433249047.HKD":"THEMATICS META \"R/A\" (HKD) ACC","LU1861214812.USD":"Blackrock Future of Transport A2 USD","LU2125909593.SGD":"Natixis Thematics Meta R/A SGD","LU1923623000.USD":"Natixis Thematics AI & Robotics Fund R/A USD","LU2063271972.USD":"富兰克林创新领域基金","LU2087625088.SGD":"ALLSPRING  US ALL CAP GROWTH \"A\" (SGDHDG) ACC","LU0056508442.USD":"贝莱德世界科技基金A2","LU2764262908.HKD":"BGF GLOBAL UNCONSTRAINED EQUITY \"A2\" (HKD) ACC","SG9999000418.SGD":"Aberdeen Standard Global Technology SGD","IE00B5949003.HKD":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A\" (HKD) ACC","LU1323610961.USD":"UBS (LUX) EQUITY SICAV - LONG TERM THEMES (USD) \"P\" (USD) ACC","LU2720916845.USD":"BGF GLOBAL UNCONSTRAINED EQUITY \"A2\" (USD) ACC","LU0097036916.USD":"贝莱德美国增长A2 USD","LU2125909247.SGD":"Natixis Thematics Meta H-R/A SGD","LU2360107325.USD":"BGF FUTURE OF TRANSPORT \"A4\" (USD) INC","LU0094547139.USD":"abrdn SICAV I - GLOBAL SUSTAINABLE EQUITY FUND \"A\" (USD) ACC","LU0728928796.USD":"abrdn SICAV I - GLOBAL SMALL&MID-CAP SDG HORIZONS EQUITY \"A\" (USD) ACC","LU0266013472.USD":"AXA WF - Framlington Longevity Economy A Cap USD","LU0323240290.USD":"HSBC GIF GLOBAL EQUITY CLIMATE CHANGE \"AD\" INC","LU1923622614.USD":"Natixis Thematics Meta R/A USD","LU2355687059.USD":"NORDEA 1 GLOBAL IMPACT  \"BP\" (USD) ACC","LU0724618433.USD":"BGF NEW ENERGY \"A4\" (USD) INC","BK4023":"应用软件","LU1721428347.USD":"BNP PARIBAS CLIMATE IMPACT \"C\" (USD) ACC","CDNS":"铿腾电子","LU2250418816.HKD":"BGF WORLD TECHNOLOGY \"A\" (HKD) ACC","LU0107464264.USD":"abrdn SICAV I - GLOBAL INNOVATION EQUITY \"A\" (USD) ACC","LU0124384867.USD":"贝莱德新能源基金A2","LU0353189680.USD":"富国美国全盘成长基金Cl A Acc","LU2477742899.HKD":"BNP PARIBAS CLIMATE IMPACT \"C\" (HKD) ACC","IE0009356076.USD":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A2\" (USD) ACC","IE00BN0W2V16.EUR":"GUINNESS SUSTAINABLE GLOBAL EQUITY \"C\" (EUR) ACC","LU0353189763.USD":"ALLSPRING  US ALL CAP GROWTH FUND \"I\" (USD) ACC","LU0323239441.USD":"HSBC GIF GLOBAL EQUITY CLIMATE CHANGE \"AC\" ACC","BK4567":"ESG概念","LU2298322129.HKD":"BGF SUSTAINABLE ENERGY \"A2\" (HKDHDG) ACC","LU0302445910.USD":"SCHRODER ISF GLOBAL CLIMATE CHANGE EQUITY \"A\" ACC","LU2764263039.SGD":"BGF GLOBAL UNCONSTRAINED EQUITY \"A2\" (SGDHDG) ACC","LU2506952410.USD":"BNP PARIBAS CLIMATE IMPACT \"CRH\" (USDHDG) ACC A","LU0354030511.USD":"ALLSPRING  U.S. LARGE CAP GROWTH \"I\" (USD) ACC","LU0354030438.USD":"富国美国大盘成长基金Cl A Acc"},"translate_title":"Cadence与Arm、三星和行业合作伙伴推出Chiplet生态系统","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"AIP":0.9,"CDNS":0.9},"content_text":"Cadence Launches Chiplet Ecosystem with Arm, Samsung, and Industry Partners\n    \n\n        Cadence Design Systems Inc. has launched a Chiplet Spec-to-Packaged Parts ecosystem aimed at reducing engineering complexity and accelerating time to market for chiplet development in physical AI, data center, and high-performance computing applications. As part of this initiative, Cadence is collaborating with Samsung Foundry to create a silicon prototype demonstration of its Physical AI chiplet platform using the Samsung Foundry SF5A process. The ecosystem also includes key IP partners such as Arm, Arteris, eMemory, M31 Technology, Silicon Creations, and Trilinear Technologies, with silicon analytics support from proteanTecs. This collaboration is designed to help customers adopt advanced chiplet technologies more efficiently and reliably.\n      \n\n\nDisclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Cadence Design Systems Inc. published the original content used to generate this news brief via Business Wire (Ref. ID: 20260106077060) on January 06, 2026, and is solely responsible for the information contained therein.","kind":"highlight","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"corporation,productRelease","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":true,"tenantId":"TBGLOBAL","deviceId":"web-server-community-laohu8-v3","version":"4.36.0","shortVersion":"4.36.0","platform":"web","vendor":"web","appName":"ttm","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2601781815","isCrawlerRequest":true}