Shenzhen Expressway Corporation Ltd. has completed the issuance of its Phase I 2026 corporate bonds in the Chinese domestic market. The offering, aimed at professional investors, raised RMB1.5 billion with a coupon rate of 1.98% and a term of five years. The bonds were issued at RMB100 each via an offline book-building process. This update confirms the completion of the bond issuance as of January 6, 2026, following earlier announcements regarding the planned offering.
Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Shenzhen Expressway Corporation Ltd. published the original content used to generate this news brief via IIS, the Issuer Information Service operated by the Hong Kong Stock Exchange (HKex) (Ref. ID: HKEX-EPS-20260106-11981053), on January 06, 2026, and is solely responsible for the information contained therein.
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