Guangdong Tianyu Semiconductor Co., Ltd. has announced that it has entered into a strategic cooperation agreement with Qinghe Jingyuan Semiconductor Technology (Group) Co., Ltd. The partnership, effective from January 16, 2026 to January 15, 2029, will focus on the joint development and technological advancement of bonding materials, including bonded silicon carbide (SiC), silicon on insulator (SOI), and piezoelectric on insulator (POI). The collaboration aims to leverage both companies' expertise in semiconductor bonding integration technology, benefiting the future development of Guangdong Tianyu Semiconductor and its stakeholders.
Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Guangdong Tianyu Semiconductor Co. Ltd. published the original content used to generate this news brief via IIS, the Issuer Information Service operated by the Hong Kong Stock Exchange (HKex) (Ref. ID: HKEX-EPS-20260116-11994003), on January 16, 2026, and is solely responsible for the information contained therein.
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