India New Issue-Summit Digitel Infrastructure to issue 10-year bonds, bankers say

Reuters01-28
India New Issue-<a href="https://laohu8.com/S/SMMT">Summit</a> Digitel Infrastructure to issue 10-year bonds, bankers say

MUMBAI, Jan 28 (Reuters) - India's Summit Digitel Infrastructure plans to raise up to 7 billion rupees ($76.25 million) through the sale of bonds maturing in 10 years, three bankers said on Wednesday.

It will pay a coupon of 7.45%, payable quarterly, and has invited commitment bids for the issue on Thursday, they said.

The company did not immediately respond to a Reuters email seeking comment.

Here is the list of deals reported so far on January 28:

Issuer

Tenure

Coupon (in %)

Issue size (in bln rupees)*

Bidding date

Rating

Summit Digitel Infrastructure

10 years

7.45(payable quarterly)

7

January 29

AAA(Icra, Care)

Cholamandalam Investment and Finance

two years and five months

7.83

20

January 27

AA+ (Icra)

360 One Prime

2 years and four months

8.80

7.51

January 28

AA (Icra)

*Size includes base plus greenshoe for some issues

($1 = 91.8050 Indian rupees)

(Reporting by Dharamraj Dhutia and Khushi Malhotra; Editing by Janane Venkatraman)

((Dharamraj.dhutia@tr.com, khushi.malhotra@tr.com))

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