Samsung Seen Regaining Competitiveness in HBM Market -- Market Talk

Dow Jones01-30

0507 GMT - Samsung Electronics is seen regaining competitiveness in the premium high-bandwidth memory chip market, Daiwa Capital's S.K. Kim and Daekoon Kim write in a note. The Daiwa analysts point to Samsung management's latest guidance at Thursday's earnings call that the company's HBM4 products--the industry's most advanced dynamic random-access memory used in artificial-intelligence accelerators--are in the final stage of qualification with a major customer. They also note that Samsung plans to ship HBM4 products in the current quarter, likely February, and is considering adopting a hybrid-bonding technology for its 16H HBM4E products. Daiwa raises its 2026-2027 EPS forecasts for Samsung by 31%-64%. (kwanwoo.jun@wsj.com)

(END) Dow Jones Newswires

January 30, 2026 00:07 ET (05:07 GMT)

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The Daiwa analysts point to Samsung management's latest guidance at Thursday's earnings call that the company's HBM4 products--the industry's most advanced dynamic random-access memory used in artificial-intelligence accelerators--are in the final stage of qualification with a major customer. They also note that Samsung plans to ship HBM4 products in the current quarter, likely February, and is considering adopting a hybrid-bonding technology for its 16H HBM4E products. Daiwa raises its 2026-2027 EPS forecasts for Samsung by 31%-64%. 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Kim and Daekoon Kim write in a note. The Daiwa analysts point to Samsung management's latest guidance at Thursday's earnings call that the company's HBM4 products--the industry's most advanced dynamic random-access memory used in artificial-intelligence accelerators--are in the final stage of qualification with a major customer. They also note that Samsung plans to ship HBM4 products in the current quarter, likely February, and is considering adopting a hybrid-bonding technology for its 16H HBM4E products. Daiwa raises its 2026-2027 EPS forecasts for Samsung by 31%-64%. 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