GCL Technology Signs 2026 Wafer and Silicon Material Products Sale Agreements with GCL System Integration

Reuters03-06
GCL Technology Signs 2026 Wafer and Silicon Material Products Sale Agreements with GCL System Integration

GCL Technology Holdings Ltd. said two indirect wholly owned subsidiaries signed framework agreements on 6 March 2026 with GCL System Integration and its Suzhou unit for continuing connected transactions. Under the 2026 Wafer Sale Agreement, GCL Technology Suzhou will sell solar grade silicon wafers to GCL System Integration from 6 March 2026 to 31 December 2026, with a transaction cap of RMB300 million including tax, and payment due within 15 days after delivery. Under the 2026 Silicon Material Products Sale Agreement, Jiangsu Zhongneng will sell solar grade silicon material products to GCL System Integration (Suzhou) over the same period, also capped at RMB300 million including tax, with monthly purchase orders setting pricing and volumes. The company also disclosed prior wafer sales of about RMB37,000 from 1 January 2026 to 5 March 2026 before the new wafer agreement was executed.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. GCL Technology Holdings Ltd. published the original content used to generate this news brief via IIS, the Issuer Information Service operated by the Hong Kong Stock Exchange (HKex) (Ref. ID: HKEX-EPS-20260306-12044596), on March 06, 2026, and is solely responsible for the information contained therein.

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