Flex’s JetCool collaborates with Broadcom on liquid cooling for next-generation AI XPUs

Reuters03-11 21:05
Flex’s JetCool collaborates with Broadcom on liquid cooling for next-generation AI XPUs

JetCool, a Flex company, collaborated with Broadcom to develop liquid cooling for next-generation AI XPUs. The companies said JetCool developed a single-phase direct-to-chip cooling solution designed to integrate with Broadcom’s mechanical and thermal reference architecture. They said the design targets sustained multi-kilowatt ASIC operation at heat flux levels of 4 W/mm² per device. Flex is expected to support high-volume manufacturing through its global production capabilities.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Flex Ltd. published the original content used to generate this news brief via PR Newswire (Ref. ID: 202603110905PR_NEWS_USPR_____SF07422) on March 11, 2026, and is solely responsible for the information contained therein.

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