Adeia renews and expands IP licensing collaboration with UMC on hybrid bonding technologies

Reuters03-11
<a href="https://laohu8.com/S/ADEA">Adeia</a> renews and expands IP licensing collaboration with UMC on hybrid bonding technologies

Adeia and UMC expanded and renewed an IP licensing relationship covering Adeia’s semiconductor portfolio, including hybrid bonding technologies. The agreement provides UMC continued access to this portfolio and extends collaboration into future generations of 3D integration and advanced packaging. UMC said the collaboration has supported 3D integration of RFSOI wafers for RF front-end modules.

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