Lumentum demonstrates 1060nm VCSEL optical interconnect co-packaged with ASIC for AI scale-up networks

Reuters03-17 20:31

Lumentum demonstrates 1060nm VCSEL optical interconnect co-packaged with ASIC for AI scale-up networks

Lumentum reported an optical interconnect demonstration for AI scale-up networks using a high-density multimode 1060 nm VCSEL array co-packaged with a host ASIC. The system targets “slow and wide” scale-up protocols including UCIe and PCIe, and is implemented in a fan-out wafer-level package with multimode fiber connectivity. Lumentum said the VCSELs and photodetectors are integrated in a two-dimensional monolithic array with backside lens technology and support channel sparing. The company said the platform is designed for operating temperatures exceeding 150°C and is based on a 3D sensing manufacturing base that has shipped more than 10 billion emitters.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Lumentum Holdings Inc. published the original content used to generate this news brief via Business Wire (Ref. ID: 202603170830BIZWIRE_USPR_____20260317_BW046310) on March 17, 2026, and is solely responsible for the information contained therein.

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