- Time Interconnect Technology proposed a final dividend of HKD 0.02 per share.
- Shareholder approval is scheduled for May 29, 2026.
- The ex-dividend date is June 2, 2026.
- The record date is June 8, 2026.
- The payment date is June 26, 2026.
Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Time Interconnect Technology Ltd. published the original content used to generate this news brief via IIS, the Issuer Information Service operated by the Hong Kong Stock Exchange (HKex) (Ref. ID: HKEX-EPS-20260327-12073687), on March 27, 2026, and is solely responsible for the information contained therein.
Comments