SEOUL, April 3 (Reuters) - SK Hynix 000660.KS has appointed Citigroup C.N, JPMorgan JPM.N, Goldman Sachs GS.N and Bank of America BAC.N as underwriters for its planned U.S. listing, the Korean Economic Daily said on Friday.
Last month, the South Korean chipmaker said it plans a confidential filing to list shares in the U.S. in the second half of 2026. SK Group chairman Chey Tae-won said the U.S. listing could help expand the shareholder base of SK Hynix beyond Korea, increasing exposure to American and international investors and strengthening its global presence.
Here are some details:
The U.S. listing is expected to raise about 10 trillion won to 15 trillion won ($6.63 billion to $9.95 billion), the newspaper reported, citing unnamed investment banking sources, adding that the funds would be used to finance artificial intelligence infrastructure, including the development of the company's Yongin chip cluster.
Last month, Reuters reported that the company's U.S. listing could raise as much as $14 billion and the funds would help finance chipmaking factories in South Korea's Yongin city and the U.S. state of Indiana.
The South Korean company's U.S. listing would potentially be more than double e-commerce group Coupang's CPNG.N $4.6 billion U.S. IPO in 2021.
"We cannot confirm at this time as the process remains at a preliminary stage, and with underwriter selection still some time away, there is nothing further we can share," SK Hynix said in a statement to Reuters.
Citi declined to comment. JPMorgan, Goldman Sachs and Bank of America were not immediately available for comment outside regular business hours.
Shares of SK Hynix were trading up 5.8% in morning trade compared with the benchmark KOSPI's .KS11 2.7% rise.
($1 = 1,509.1000 won)
(Reporting by Heekyong YangEditing by Ed Davies)
((Heekyong.Yang@thomsonreuters.com;))
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