Market Chatter: TSMC to Delay Use of ASML's Next-Generation Chipmaking Gear Over Cost Concerns

MT Newswires Live12:26

Taiwan Semiconductor Manufacturing (TPE:2330), or TSMC, plans to postpone the use of next-generation high-NA EUV lithography systems from ASML for chip production until at least 2029, over cost concerns, Bloomberg News reported Thursday.

TSMC's Deputy Co-COO Kevin Zhang said existing EUV tools continue to deliver sufficient performance, with the company targeting mass production of its A13 chips in 2029. The advanced machines, priced above 350 million euros each, are currently being used by the chipmaker only for research purposes, according to the report.

The delay may dampen expectations for ASML, which is relying on wider industry adoption of the technology to drive future revenue, Bloomberg said.

(Market Chatter news is derived from conversations with market professionals globally. This information is believed to be from reliable sources but may include rumor and speculation. Accuracy is not guaranteed.)

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